A modified low-temperature wafer bonding method using spot pressing bonding technique and water glass adhesive layer

Yang Xu,Shengkai Wang,Yinghui Wang,Dapeng Chen
DOI: https://doi.org/10.7567/jjap.57.02bd01
IF: 1.5
2017-11-24
Japanese Journal of Applied Physics
Abstract:A modified low-temperature wafer bonding method using a spot pressing bonding technique and a water glass adhesive layer is proposed. The electrical properties of the water glass layer has been studied by capacitance–voltage (C–V) and electric current–voltage (I–V) measurements. It is found that the adhesive layer can be regarded as a good insulator in terms of leakage current density. The bonding mechanism and the motion of bubbles during the thermal treatment are investigated. The dominant factor for the bubble motion in the modified bonding process is the gradient of pressure introduced by the spot pressing force. It is proved that the modified method achieves low-temperature adhesive bonding, minimizes the effect of water desorption, and provides good bonding performance.
physics, applied
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