Tensile-strained Ge 1− x Sn x layers on Si(001) substrate by solid phase epitaxy featuring seed layer introduction

Tatsuma Hiraide,Shigehisa Shibayama,Masashi Kurosawa,Mitsuo Sakashita,Osamu Nakatsuka
DOI: https://doi.org/10.35848/1347-4065/ad358f
IF: 1.5
2024-03-19
Japanese Journal of Applied Physics
Abstract:Abstract Herein, we examined the seed layer induced solid-phase epitaxy (SPE) of Ge 1− x Sn x layers on Si(001) substrate toward their in-plane strain control. We sequentially deposited the crystallized Ge 1− x Sn x seed layers at 360 °C with thicknesses of 2 and 4 nm and amorphous Ge 1− x Sn x layers at 80 °C. First, it was found that the polycrystalline Ge 1− x Sn x is likely formed for no seed layer case whereas the thicker Ge 1− x Sn x seed layer effectively promotes the Ge 1− x Sn x epitaxial growth. Then, we discussed a possible role of the seed layer on the SPE promotion on Si(001). Finally, we demonstrated that the in-plane strain ε in the SPE-Ge 1− x Sn x layer can be controlled by the annealing temperature according to the thermal expansion coefficient difference between SPE-Ge 1− x Sn x layer and Si substrate. In this study, we succeed to form tensile-strained Ge and Ge 1− x Sn x layers on Si(001) substrate by 500 °C annealing; ε values were 0.28% and 0.18% respectively.
physics, applied
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