Curing kinetics and thermal properties of [2,2] paracyclophane/bisphthalonitrile-terminated imide resins
Jiabo Zhang,Bo Liang,Xian He,Maoyu Yi,Wenjie Yang,Jianghuai Hu,Ke Zeng,Gang Yang
DOI: https://doi.org/10.1016/j.mtcomm.2024.110190
IF: 3.8
2024-08-27
Materials Today Communications
Abstract:Combining phthalonitrile and polyimide through molecular structure design is an idea to develop novel heat-resistant resins. The main reactive group contained in phthalonitrile is the nitrile group (CN). By utilizing the characteristic that [2,2] paracyclophane (PcP) can promote the curing of phthalonitrile, PcP /bisphthalonitrile-terminated imide resins were prepared. The 4,4′-bisphenol A dianhydride (BPADA) is the main structure of the imide. Two monomers are named BPADA-PcP and BPADA-CN. The blend system of two monomers exhibits excellent processing properties. Different cured resins were obtained by adjusting the blend ratios and final curing temperature. TGA and DMA analysis showed that cured resins show excellent thermomechanical properties at relatively low curing temperatures. In addition, the curing kinetics parameters of PcP, a reactive group, were studied based on non-isothermal DSC. BPADA-PcP exhibited a bimodal curing heat flow profile, whereas the blend system of two monomers in 1:1 molar ratio exhibited a singular heat flow peak, suggesting differences in curing mechanisms. The activation energies of PcP-terminated imide and the blend in 1:1 molar ratio were calculated using model-free isoconversional method. It was found that all three reaction processes follow the autocatalytic mechanism.
materials science, multidisciplinary