Effect of high-temperature thermo-oxidation on the mechanical and electrical properties of phenylethynyl-terminated polyimide/carbon fiber composite

Hao Wang,Ziqiao Wang,Naihang Kuang,Chao Wu,Yu Lu,Chunhua Zhang

DOI: https://doi.org/10.1016/j.polymdegradstab.2023.110544

IF: 5.204

2023-09-29

Polymer Degradation and Stability

Abstract:The thermal degradation behaviors of phenylethynyl-terminated polyimide and their carbon fiber reinforced composites (CFRC) are significant to be evaluated comprehensively as their high-temperature applications are gradually expanded. It is found that ether-containing thermoset polyimide (PI) film shows unique degradation behaviors near glass transition temperature ( T g ). Though the triethylamine (Et 3 N) chemical imidization method is applied, the PI backbone shows thermal stability at 371°C thermo-oxidation condition and the main degradation parts site at the curing structure. More aliphatic (C-C) linkages will be formed in the thermo-oxidation process and they are ascribed to the further crosslinking behaviors of polyene structure. However, the PI film shows stable mechanical properties after thermo-oxidation. Meanwhile, the formation of an amorphous carbon structure is found after thermo-oxidation treatment, which endows the composite with enhanced electrical properties. Though the micro-cracking phenomenon happens at the matrix/CF interface of composite surface and thus degrades its mechanical properties, the in-plane longitudinal and transverse conductivity of the composite perform an increase, factors of 1.13 to 2.56×10 4 S/m and 2.28 to 454.8 S/m, respectively. Mechanism study indicates that the formation of amorphous carbon components is caused by the structural rearrangement of the degrading polyene curing structure and becomes more in the thermo-oxidation process, not affecting the backbone integrity and mechanical stability of the PI matrix. As a result, thermo-oxidation treatment degrades the mechanical properties of the composite, whereas the formed amorphous carbon component acts as a self-growing carbon-based nano-filling structure at the PI/CF interface and enhances the electrical contact of the carbon fibers.

polymer science