Low-temperature in-situ grown mullite whiskers toughened heat-resistant inorganic adhesive

Mingchao Wang,Zhaojie Feng,Chenxi Zhai,Jingfang Zhang,Zepeng Li,Haijun Zhang,Xiqing Xu
DOI: https://doi.org/10.1016/j.jallcom.2020.155349
IF: 6.2
2020-09-01
Journal of Alloys and Compounds
Abstract:<p>The temperature required for growth of mullite whiskers in heat-resistant adhesive was decreased to 700 °C based on solid-liquid-solid (S-L-S) mechanism. The bonding strength was increased by 23.1% (700 °C) ∼ 60.7% (1200 °C), and the maximal 32.3 MPa was achieved after sintered at 1200 °C. Moreover, the whiskers-grown adhesive also displayed better anti-damage capacity, and multiple grading fractures occurred during the test procedure, which was mainly due to the pull-out mechanism.</p>
materials science, multidisciplinary,chemistry, physical,metallurgy & metallurgical engineering
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