Abstract:Two dimensional (2D) integration has been the traditional approach for IC integration. Due to increasing demands for providing electronic devices with superior performance and functionality in more efficient and compact packages, has driven the semiconductor industry to develop more advanced packaging technologies. Three-dimensional (3D) approaches address both miniaturization and integration required for advanced and portable electronic products. Vertical integration proved to be essential in achieving a greater integration flexibility of disparate technologies, reason for which a general trend of transition from 2D to 3D integration is currently being observed in the industry. 3D chip integration using through silicon via (TSV) copper is considered one of the most advanced technologies among all different types of 3D packaging technologies. Copper electrodeposition is one of technologies that enable the formation of TSV structures. Because of its well-known application for copper damascene, it was believed that its transfer to filling TSV vias would be easily adopted. However, as any new technology at its beginning, there are several challenges that need to be addressed and resolved before becoming a fully mature technology. This paper will address the TSV fill processes using copper electrodeposition, the advantages as well as difficulties associated with this technology and approaches taken to overcome them. Electrochemical characterization of the organics behavior and their effect on via filling will be presented. The effect of wafer design on process performance and throughput, including necessary process optimizations that are required for achieving void-free via filling while reducing the processing time, will be discussed.

Copper electroplating technique for efficient manufacturing of low-cost silicon interposers

Influence of Electroplating Current Density on Through Silicon Via Filling

Study on the behaviors of Cu filling in special through-silicon-vias by the simulation of electric field distribution

Copper Filling Process for Small Diameter, High Aspect Ratio Through Silicon Via (Tsv)

Through silicon via copper electrodeposition for 3D integration

High Aspect Ratio Copper Through-Silicon-vias for 3D Integration

Fast copper plating process for TSV fill

Fabrication and Characterization of Annular Copper Through-Silicon Via for Passive Interposer Applications

Bottom-up Copper Electroplating Using Transfer Wafers for Fabrication of High Aspect-Ratio Through-Silicon-vias

Copper Electrodeposition for 3D Integration

Optimization of innovative approaches to the shortening of filling times in 3D integrated through-silicon vias (TSVs)

Microfabrication of Through Silicon Vias (TSV) for 3D SiP

Fabrication and In-Situ Evaluation of Copper TSV Interconnection

CU seed, CMP process development and via resistance extraction in through silicon via technology

Design and fabrication of a TSV interposer for SRAM integration

Simultaneously performing interlayer copper interconnecting and TSV filling in stacked chips at room temperature based on copper electroplating

Fabrication, Characterization, and Simulation of a Low-Cost TSV Integration Without Front-Side CMP Process

Copper Pulse-Reverse Current Electrodeposition to Fill Blind Vias for 3-D Tsv Integration

3D interconnection process development and integration with low stress TSV

Understanding Effect of Additives in Copper Electroplating Filling for Through Silicon Via

Interposer Fabrication with Annular Copper Tsv and Multi-Layered Redistribution Layer