Abstract:Laser-assisted diamond machining provides a cost-effective approach for cutting hard and brittle materials. To expand its practical application, a comprehensive understanding of the design methodology of the laser-assisted diamond machining system and optimization of process parameters for machining single crystal silicon is crucial. This study presents, for the first time, an optical design methodology, with a particular emphasis on the design method for diamond cutting tools. The adequacy of the proposed method is verified through optical simulation. The numerical analysis indicates that the incident surface of the diamond cutting tool should be positioned within the Rayleigh range of the laser beam, and the optimal laser incident height is determined to be 0.7 mm. Furthermore, high-temperature nanoindentation tests reveal a significant reduction in the hardness of single crystal silicon by 72.04 % and a reduction in Young's modulus by 30.70 % at a temperature of 600 °C due to increased dislocation activity. Orthogonal experiments based on the Taguchi method reveal that the feed speed has the most significant impact on the resultant force during laser-assisted diamond machining of single crystal silicon. The contribution rates of spindle speed, feed speed, cutting depth, and laser power to the resultant force are determined to be 31.47 %, 35.82 %, 22.02 %, and 8.04 % respectively. A regression model is established through multiple nonlinear regression analysis to quantify the correlation between the input parameters and the resultant force. The optimal parametric combination is determined using nonlinear programming optimization, resulting in a spindle speed of 3061.45 rpm, a feed speed of 4 mm/min, a cutting depth of 4 μm, and a laser power of 1.5 W. Validation experiments demonstrate that the established mathematical regression model accurately forecasts the resultant force.

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Numerical investigations of water jet-guided laser cutting of silicon

Investigation on system design methodology and cutting force optimization in laser-assisted diamond machining of single-crystal silicon

Molecular dynamics simulation study on ablation of silicon by water-jet-guided laser

Modeling and optimizing of laser-assisted waterjet process parameters for near-damage-free micromachining of monocrystalline silicon

Sub-damage-threshold plasma etching and profile tailoring of Si through laser-stimulated thermal desorption

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Nanosecond Laser Processing for Improving the Surface Characteristics of Silicon Wafers Cut Using Wire Electrical Discharge Machining

Thermal analysis of in-situ laser assisted diamond cutting of fused silica and process optimization

Investigation on Slicing Behavior of Single Crystal Silicon Wafer in AWJM and Influence of Micro Dimple Textured Surface for Solar Applications

Investigation on high-aspect-ratio silicon carbide ceramic microchannel by using waterjet-assisted laser micromachining

Laser micro/nano machining of silicon

Efficiency of silicon micromachining by femtosecond laser pulses in ambient air

Laser slicing of 4H-SiC wafers based on picosecond laser-induced micro-explosion via multiphoton processes

Ytterbium femtosecond fiber laser ablation synthesis of silicon nanocrystals in water: Laser frequency and pulse energy dependence

Nanosecond pulsed laser ablation of silicon—finite element simulation and experimental validation

Recent Advances in Precision Diamond Wire Sawing Monocrystalline Silicon

Dimethicone-aided laser cutting of solar rolled glass

Water jet guided nanosecond laser cutting of CFRP

Surface Integrity of Water Jet Guided Laser Machining of CFRP

Laser cutting sandwich structure glass–silicon–glass wafer with laser induced thermal–crack propagation