Abstract:The traditional way to machine hybrid composites is hard because they tend to break, have a high retraction, have a high service temperature, and have an uneven surface irregularity. For high-strength fiber/metal composite constructions, alternative machining methods have drawn interest as a solution to these problems. Current research focuses on enhancing the Abrasive Water Jet Machining process by optimizing its variables using a composite material of epoxy reinforced with silicon carbide, stainless steel wire mesh, and Kevlar. The variables assessed are the Nozzle-to-substrate gap (S), the Abrasive discharge molding and different percentages of silicon carbide (SiC) filler (0%, 3%, and 6% by weight), three different types of hybrid laminates (H1, H2, and H3) were produced. The response surface method (RSM) was utilized in this learning, specifically on a central composite design, to calculate and optimize machining variables based on the Kerf convergence ratio (Kt) and Surface irregularity (Ra) as responses. According to the results, the traverse feed velocity, Abrasive discharge proportion, and Nozzle-to-substrate gap are the critical factors in determining Surface irregularity and Kerf convergence width (H1 laminate) for a fiber/metal laminate with 0%, 3% and 6% weight fraction. In the case of a 3% weight fraction H2 laminate, the traverse feed velocity was identified as the primary factor affecting the Kerf convergence ratio. In contrast, traverse feed velocity and Nozzle-to-substrate gap had the most significant influence on Surface irregularity. The findings also indicated that S, followed by Abrasive discharge proportion and traverse feed velocity, are the variables that have the most significant influence when cutting 6 wt% SiC filler particle fiber/metal laminate (H3 laminate). For Surface irregularity, the combination of traverse feed velocity and Nozzle-to-substrate gap had the most significant impact. To validate the optimization results, confirmatory tests was conducted, and the findings were very similar to the experimental values, indicating the accuracy and effectiveness of the optimization process. To better understand the manufacturing processes, a scanning electron microscope was used to examine the morphological features of the machined surfaces, such as delamination, fibre breakage, and fibre pull-out.

Investigation on Slicing Behavior of Single Crystal Silicon Wafer in AWJM and Influence of Micro Dimple Textured Surface for Solar Applications

Investigations on the Influence of Surface Textures on Optical Reflectance of Multi-crystalline Silicone (MC-Si) Crystal Surfaces-Simulations and Experiments

Surface formation, morphology, integrity and wire marks in diamond wire slicing of mono-crystalline silicon in the photovoltaic industry

Nanosecond Laser Processing for Improving the Surface Characteristics of Silicon Wafers Cut Using Wire Electrical Discharge Machining

Experimental study regarding the surface roughness of circular crystal wafers sliced by a multi-wire saw with reciprocating and rocking functions

Surface Micromorphology and Nanostructures Evolution in Hybrid Laser Processes of Slicing and Polishing Single Crystal 4H-Sic

Investigation on the Edge Chipping in Ultrasonic Assisted Sawing of Monocrystalline Silicon

Recent Advances in Precision Diamond Wire Sawing Monocrystalline Silicon

Numerical investigations of water jet-guided laser cutting of silicon

Influence of Surface Preprocessing on 4H-SiC Wafer Slicing by Using Ultrafast Laser

Modeling and optimizing of laser-assisted waterjet process parameters for near-damage-free micromachining of monocrystalline silicon

Experimental Analysis of Ductile Cutting Regime in Face Milling of Sintered Silicon Carbide

Research on Silicon Wafer Surface Phase under the Ultra-thin Slicing Process and Its Etching Hindrance Behavior during Metal-Assisted Chemical Etching

Experimental investigations on the laser-assisted machining of single crystal Si for optimal machining

Depletion of Reflectance of Silicon Surface Textured Using Nano Second Fiber Laser

The surface residual stress of monocrystalline silicon in ultrasonic vibration–assisted diamond wire sawing

Fractal analysis on the surface topography of Monocrystalline silicon wafers sawn by diamond wire

Water Jet Guided Laser Cutting of Silicon Thin Films Using 515nm Disk Laser

A Microscopic Tem Study Of The Defect Layers In Cast-Mono Crystalline Silicon Wafers Induced By Diamond-Wire Sawing

Characterization and Optimization of Abrasive Water Jet Machining Parameters of aluminium/silicon carbide Composites

Effect of silicon carbide on kerf convergence and irregularity of the surface during abrasive water jet machining of fiber-metal hybrid composites