Abstract:Electronically conductive adhesives (ECAs) are commonly used in IC and LED packaging. Copper (Cu) powders can be applied to ECAs as conductive filler. Micron-sized Cu powders has many excellent physical properties and catalytic activity. However, after the Cu powders has been microfined, it is easily oxidised to cuprous oxide in air due to the large specific surface area of the Cu particles and their high chemical activity. The silver-coated copper (Cu@Ag) powders is formed by Ag plating on the surface of the Cu powders, which not only improves the oxidation resistance of Cu, but also maintains the excellent electrical conductivity of Cu. During the replacement reaction, the dotted Ag is the positive electrode of the micro-battery, and the Cu that has not been replaced on the surface is the negative electrode. Ag ions can be reduced and deposited on Cu powder by chemical substitution reaction. Economically, Cu@Ag powders as filler can not only enhance the performance of ECAs but also reduce the cost of ECAs. The SEM image of Cu@Ag shows a high Ag content of 90 wt% on the surface of Cu as can be seen by the EDS spectrum. The oxidation of Cu powders can be effectively inhibited by plating Ag on Cu surface and play a great role in the oxidation resistance of Cu. Moreover, the application of Cu@Ag powders with different morphologies promoted the curing of ECAs. Under the optimal curing process, ECAs’ bulk resistivity was 21.27×10 -3 Ω•cm, 3.27×10 -3 Ω•cm, and the shear strength was 17.66 MPa, 12.24 MPa when adding 75 wt% spherical and flaky Cu@Ag powders, respectively. When filled with two different shapes of Cu@Ag powders, the ECA had a bulk resistivity of 1.75×10 -3 Ω•cm and a shear strength of 20.39 MPa. The better comprehensive performance of the bi-component ECAs was proved.

Silver coated copper powder conductive adhesive and preparation method thereof

Preparation of silver nanopowders and its application in low temperature electrically conductive adhesive

Preparation and characterization of Ag conductive adhesive with low resistivity

Synthesis and Properties of Copper Conductive Adhesives Modified by SiO2 Nanoparticles

Effect of Flake Silver-Plated Copper Particles on the Property Enhancement of Electrically Conductive Adhesives.

Preparation and Properties of Cu-PPO Conductive Adhesive Filled with Copper Nanoparticle

Preparation of micron-scale Cu@Ag conductive particles by displacement coating to reinforce epoxy conductive adhesives

Preparation of Low Volatile Organic Compounds Silver Paste Containing Ternary Conductive Fillers and Optimization of Their Performances

Electrical properties of electrically conductive adhesives from epoxy and silver-coated copper powders after sintering and thermal aging

Study on the Anti-Oxidant Property of Copper Powder Coated Silane Coupling Agent in Isotropically Conductive Adhesives

Preparation of silver-coated copper powders and its application in conductive adhesives

Electrical Property Improvement of Copper Filler Conductive Adhesive with Low-Melting Point Metal Bridge

Synthesis and Properties of Hyperbranched Poly (Amine-Ester) Modified Polysiloxane/Nano-silver Conductive Adhesives

Preparation and Performance of Epoxy Resin Conductive Adhesive with Fast-Curing Feature at Low Temperature

Copper Particles/epoxy Resin Thermosetting Conductive Adhesive Using Polyamide Resin As Curing Agent

In situ preparation and sintering of silver nanoparticles for low-cost and highly reliable conductive adhesive

Ultra-low Temperature Curable Conductive Silver Adhesive with different Resin Matrix

Copper conductive adhesives for printed circuit interconnects

Electrically conductive epoxy‐based nanocomposite adhesives loaded with silver‐coated copper and silver‐coated reduced graphene oxide nanoparticles

Method for preparing anti-oxidation copper conductor paste

Binder Chemistry for Ultra-Highly Conductive Pastes by Low Temperature Sintering of Silver Micro-Fillers