Abstract:Low-temperature silver paste (LT-SP) is a critical conductive material for its use in flexible electronic devices. The high-purity thinner-coated Ag NPs with a size of about 100–200 nm are important for their oxidation resistance. Here, by adjusting mixed reduction of ascorbic acid (Vc), glucose (Clu), and sodium citrate (Na(3)Cit), with n(AgNO 3 ): n(SDS) at 3:1, the size of obtained Ag NPs can be decreased to 158.1 nm. A simple natural precipitation purification was performed to obtain large-scale, thinner SDS-coated Ag NPs with lower energy consumption. With the increase of purification times from 1 to 3 and 5, the purification time was longer and longer, the surface coating layer decreased from 3.716 to 1.429 and 1.093 wt.%, and the size of the initial soft agglomerated Ag NPs gradually dispersed from 481.4 to 153.5 and 97.6 nm, indicating that the surface coating layer gradually became thinner. Considering the properties requirement/time-cost, 3 times purification was chosen. To improve the properties of LT-SP, a single green–white glue (PVAc) with excellent adhesion was used as the organic carrier, which was added to the obtained Ag NPs to produce a series of LT-SP samples. When Ag-4.8 wt.% PVAc, a low resistance of 6.2 × 10 −8 Ω cm could be obtained by sintering at 140 °C for 25 min, and excellent electrical conductivity was still maintained after 50,000 times bending. Its adhesion could reach the 4B standard confirmed by the Burger test. In summary, an excellent LT-SP can be large-scale produced with high-purity thinner SDS-coated Ag NPs and PVAc organic carriers.

Effect of Introducing Conductive Organic Carrier on Properties of Low-Temperature Conductive Silver Paste

Preparation of Low Volatile Organic Compounds Silver Paste Containing Ternary Conductive Fillers and Optimization of Their Performances

Investigation of 1-hexanol base silver paste formula for low-temperature sintering

Preparation and characterization of low temperature curing conductive silver paste for screen printing

Effects of organic additives on the microstructural, rheological and electrical properties of silver paste for LTCC applications

Silver frameworks based on self-sintering silver micro-flakes and its application in low temperature curing conductive pastes

Exploration of organic matrixes in conductive silver paste: a comprehensive review

Tuning the electrical resistivity of conductive silver paste prepared by blending multi-morphologies and micro-nanometers silver powder

Preparation and characterization of Ag conductive adhesive with low resistivity

Effect of Diluent on Ultra-low Temperature Curable Conductive Silver Adhesive

Effects of Organic Vehicle on the Rheological and Screen-Printing Characteristics of Silver Paste for LTCC Thick Film Electrodes

The effect of thinner SDS-coated Ag NPs and organic carrier PVAc on properties of low-temperature silver paste

Synthesis of Silver Flakes and Their Application as Conductive Filler for Low-Curing-Temperature Silver Pastes

Effects of Metallo-Organic Decomposition Agents on Thermal Decomposition and Electrical Conductivity of Low-Temperature-Curing Silver Paste

Low temperature-cured electrically conductive pastes for interconnection on electronic devices

Physical Properties of Paste Synthesized from Wet- and Dry-Processed Silver Powders

Preparation of conductive silver paste using bimodal particles

Binder Chemistry for Ultra-Highly Conductive Pastes by Low Temperature Sintering of Silver Micro-Fillers