Abstract:Conductive polymers have a vast market in integrated circuits (IC) and microsystems packaging to enhance mechanical, thermal, electrical performance, and cost effectiveness[1]. Isotropically conductive adhesives (ICAs) have been explored for attaching encapsulated surface mount components on rigid and flexible printed circuits [2]. However, the practical use of conductive adhesives in surface mount applications is limited because of the weak electric conductivity. Jiang et al [3] used nano-sized silver particles as a candidate for conducting filers in order to reduce the sintering temperature, but the contact resistance is still high. Some groups [4, 5] studied a series of methods such as using carboxylic acid group containing chemicals as surfactants to enhance the conductivity of ICAs in a variety of conditions, but because the micron-sized silver fillers have a high sintering temperature, the enhancement in conductivity is still limited. In order to further improve the conductivity of ICAs and minimize the cost, we experimented on a series of materials for silver surface pretreatment. We noticed an about 20 times improvement in conductivity of the modified ICA than the control sample (75% silver content in all samples). The volume resistivity of the optimum formulation reached the level of 10-6 Omegaldrcm. We also analyzed the adhesion strength and thermal property of the modified ICA material. The study indicated that both the electrical properties and the mechanical property were improved without negatively affecting the other physical properties, and they are both remain stable after subjecting to the 85degC and 85% relative humidity conditioning test.

Effect of Diluent on Ultra-low Temperature Curable Conductive Silver Adhesive

Ultra-low Temperature Curable Conductive Silver Adhesive with different Resin Matrix

Preparation and characterization of Ag conductive adhesive with low resistivity

Effects of Nano Fillers on the Conductivity, Adhesion Strength and Reliability of Isotropic Conductive Adhesives (ICAs)

Effect of Introducing Conductive Organic Carrier on Properties of Low-Temperature Conductive Silver Paste

Surface Treatment of Micron Silver Flakes with Coupling Agents for High-Performance Electrically Conductive Adhesives

Preparation and Performance of Epoxy Resin Conductive Adhesive with Fast-Curing Feature at Low Temperature

The Effect of Functionalized Silver on Rheological and Electrical Properties of Conductive Adhesives

Using Novel Materials to Enhance the Efficiency of Conductive Polymer

Improvement in the Thermal Conductivity of Silver Epoxy Adhesive by Treating with Water Vapor

Binder Chemistry for Ultra-Highly Conductive Pastes by Low Temperature Sintering of Silver Micro-Fillers

Effect of Flake Silver-Plated Copper Particles on the Property Enhancement of Electrically Conductive Adhesives.

Surface Functionalization of Micrometer Silver Flakes for Fabricating High-Performance Electrically Conductive Adhesives

Preparation of MXene and its application in low temperature electrically conductive adhesive

Microstructure Regulation and Fabrication of Epoxy-based Conductive Films with Excellent Electrical and Thermal Conductivity, Adhesion, Toughness, and Flexibility

Preparation of silver nanopowders and its application in low temperature electrically conductive adhesive

Effect of MXene fillers on the electrical conductivity of Ag-coated Cu conductive adhesives

Preparation of Low Volatile Organic Compounds Silver Paste Containing Ternary Conductive Fillers and Optimization of Their Performances

Conductivity Enhancement of Polymer Composites Using High-Temperature Short-Time Treated Silver Fillers

Effects of mixing procedures on the volume fraction of silver particles in conductive adhesives

Effect of Nano-Sized Silver Particles on the Resistivity of Polymeric Conductive Adhesives