Thermal expansion behavior of nitrogen-processed Al6061/SiC composites

Kanhu Charan Nayak,Hyunjoo Choi,Kon-Bae Lee
DOI: https://doi.org/10.1007/s10853-024-10170-0
IF: 4.5
2024-10-09
Journal of Materials Science
Abstract:Developing of lightweight materials with extremely low thermal expansion is crucial across various sectors. While Invar exhibits a coefficient of thermal expansion (CTE) below 3 × 10 −6 °C −1 , its heavy nature limits its applicability in electric vehicles and aerospace fields. The present study introduces Al6061/SiC composites produced by the nitrogen-induced self-forming aluminum composite (NISFAC) process, wherein CTE is successfully tailored down to an unprecedented value of 2.12 × 10 −6 °C −1 at 100 °C by changing the volume fraction of SiC from 0 to 65%. In-situ AlN, formed at the interface between Al6061 and SiC particles during the NISFAC process, plays a crucial role in minimizing the thermal expansion of the composites by improving crystallographic match and adhesion between SiC particles and the Al matrix.
materials science, multidisciplinary
What problem does this paper attempt to address?