Abstract:<p>The active element Ti is always added to Cu-, Ag-, or Sn-based fillers used to join ceramics, because it promotes the wetting of the fillers on ceramics. However, different mechanisms have been proposed on the mode of action of the active element Ti in promoting the wetting of the filler alloy. In this study, in order to gain a better understanding of the two controversial wetting mechanisms, which are based on adsorption and interfacial reaction, density functional theory (DFT) calculations were performed to investigate the role of the active element on the interfacial properties of the Cu–Ti/AlN wetting system. The following three typical wetting interface models were constructed: (1) the original interface of Cu/AlN, (2) adsorption interface of Cu/AlN(Ti), and (3) reaction interface of Cu/TiN. First, according to the convergence of the surface energy, a four-atom-layer Cu (111) slab, an eight-atom-layer AlN (001) slab, and a five-atom-layer TiN (001) slab were used to represent the Cu bulk, AlN bulk, and TiN bulk, respectively. Then, interface models were constructed and the work of adhesion, Bader charges, differential charge density, and density of states were analyzed, and the theoretical contact angles were calculated. The results indicate that both the adsorption of Ti at the interface and its reaction with AlN to form a TiN layer remarkably improve the wetting of Cu on AlN, and the contact angle decreased from 173° to 74° and then to 119°. This study constitutes a modest step toward clarifying the wetting mechanism of Ti-added active fillers on ceramics.</p>

First-principles simulations of metal-ceramic interface adhesion: Co/WC versus Co/TiC

First principles calculation of interfacial stability, electronic and mechanical properties of WC-304 cemented carbides

Adhesion, bonding and tensile properties of Ti doped WC (001)/diamond (111) interface: A first-principles calculation

Interfacial structure of WC-Fe metal-matrix composite (WC/Fe3W3C and Fe/Fe3W3C) stability, electronic and mechanical properties from first-principles calculations

First-principles calculation on β-SiC(111)/α-WC(0001) interface

Investigation on the WC/Cu interfacial bonding properties: First-principles prediction and experimental verification

Tensile Properties and Fracture Mechanism of the Ti2AlC(0001)/TiAl(111) Interface: Insights from a First-Principles Study

Research On Wear Behavior Of Atc Cermet Material

Interface properties of Ti3SiC2/Al2O3 ceramics: Combined experiments and first-principles calculations

Insight into interface cohesion and impurity-induced embrittlement in carbide dispersion strengthen tungsten from first principles

Research on Interface Bonding Properties of TiAlSiN/WC-Co Doped with Graphene

Adhesive and tensile properties of diamond(001)/TiC(111) interfaces: A first-principles investigation

Comparative research on the interfacial properties of Ni/diamond and Ni/graphene interface with Cr, B, and Si additions by first-principles calculation

Adhesion and material transfer between contacting Al and TiN surfaces from first principles

Effects of WC/TiC addition on the thermodynamic behavior of TiB 2 -based cermet during sintering process

Experimental and first-principles study on TiB/TiC interface in hybrid (TiB+TiC)/Ti6Al4V composite

Adhesive wear performance of hardmetals and cermets

Interface Calculation of In Situ Micro-Nano TaC/NbC Ceramic Particle Composites

First-principles calculations of the effects of the interface microstructure on the wettability of a Cu–Ti/AlN system

Thermodynamic analysis of the interface reaction and thermal stress of WCp/Fe composites

Microstructural characteristics and wear-resistant mechanisms of WC-TiC-co coatings with varying TiC contents