Analysis of formation mechanism of deposited film in a high-aspect-ratio hole during dry etching using fluorocarbon gas plasmas

Noboru Hiwasa,Junji Kataoka,Norikatsu Sasao,Shuichi Kuboi,Daiki Iino,Kazuaki KURIHARA,Hiroyuki Fukumizu
DOI: https://doi.org/10.35848/1882-0786/ac8d46
IF: 2.819
2022-08-27
Applied Physics Express
Abstract:In the dry etching process using fluorocarbon (FC) gas, deposited amorphous-CFx (a-CFx) films in patterns, such as holes and trenches, strongly affect the etching performance. The influence of the FC gas molecular structures and their atomic compositions on the formation of a-CFx films at different positions in the holes were investigated. It was found that the deposition region and thickness of the a-CFx film strongly depend on the molecular structures of the FC gas, such as double bonds, benzene rings, and the atomic ratio of fluorine to carbon.
physics, applied
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