Etching characteristics of hydrogenated amorphous carbon with different sp 2 /sp 3 hybridization ratios in CF 4 /O 2 plasmas

Jie Li,Sun J. Kim,Seunghun Han,Yongjae Kim,Heeyeop Chae
DOI: https://doi.org/10.1002/ppap.202100075
IF: 3.877
2021-08-26
Plasma Processes and Polymers
Abstract:Amorphous carbon is used as a hard mask for dielectric etching with a high aspect ratio in the fabrication processes of semiconductor devices. The dependence of the etching characteristics of hydrogenated amorphous carbon (a-C:H) films on the sp2/sp3 hybridization ratios was studied for CF4/O2 plasma mixtures. The etch rate of sp3-rich a-C:H is 33.7 times higher than that of sp2-rich a-C:H in a plasma comprising 50% CF4 and 50% O2. The etch rate of the sp2-rich a-C:H exhibits a linear correlation with the ion density of CF4/O2 plasma, whereas that of the sp3-rich a-C:H exhibits a second-order exponential correlation with O radical density. A combined etch rate model was suggested to explain the etch rates of a-C:H. Ion-enhanced etching is identified as the dominant etching mechanism for the sp2-rich a-C:H, whereas spontaneous chemical etching is the main reaction mechanism for the sp3-rich a-C:H in CF4/O2 plasmas.
physics, condensed matter, applied, fluids & plasmas,polymer science
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