Abstract:Usually, resistors and capacitors populate majority portion of a common electrical circuit, hence miniaturization drive of any package or subsystem starts with miniaturized resistor and capacitors. In this context, thin film chip resistors are the most sought-after components for any electronic/electrical circuit due to their small size, wide range of values, military temperature range, stringent tolerance, low TCR value (recognised with PPM). Increased use of thin-film surface mount chip resistors in military and space application has led to an increased awareness of its potential failure modes in harsh environments. Thin film resistor with lower TCR (5PPM, 10PPM and 25PPM) are most preferable and widely used because of very low temperature coefficient of resistance (TCR) and high resistivity, which suits for high precision measurement application. Low temperature coefficients characteristics of thin film resistors also makes them stable and reliable. Because of their high-volume usage in recent times, failure in thin film resistor with lower TCR/PPM (Parts per Million) are also being seen more predominantly. In general, there are two types of thin film chip resistors, one is discrete type and the other is die type or wire bondable type. Discrete type chip resistor are used directly on cards, whereas, die type/wire bondable type chip resistors used in hermetically sealed HMC packages. Standard failure mode of a resistor is open mode or high resistance mode, whereas short mode failure has a very low probability. Hence in this paper, failure modes and mechanisms of both types of thin film chip resistors, with respect to common failure causes such as EOS, ESD are discussed, which is in continuation to Fabrication/Workmanship related failures discussed in our earlier technical paper. With this, all possible failure modes and mechanism related thin film chip resistors are explained. Discussion in totality always provide in depth analysis on a subject of concern, which in turn facilitate reliability assessment of the component and corrective action, if any.

Electrical and thermal behavior for DC and pulsed stress on chip resistors

Transient Electrothermal Analysis of Interconnects in the Presence of a ESD pulse

Electro-Thermo-Mechanical Investigation On Multi-Level Interconnects In The Presence Of An Esd Pulse

Implementation Of Temperature Dependent Contact Resistance Model For The Analysis Of Deep Submicron Devices Under Esd

Transient Electrothermal Analysis of Multilevel Interconnects in the Presence of ESD Pulses Using the Nonlinear Time-Domain Finite-Element Method

Electrothermal-Stress Interactions of LDMOS FET Induced by DCI RF-Pulses

Performance of thin-film chip resistors

Transient Electro-Thermo-mechanical Responses of Wire Bonding Interconnects Illuminated by an Electromagnetic Pulse

A Comprehensive Study on Failure Modes and Mechanisms of Thin Film Chip Resistors

Thick Film Resistor Failures

Breakdown Voltage of Ultrathin Dielectric Film Subject to Electrostatic Discharge Stress

A Novel and Powerful TCAD Methodology to Evaluate Performance of ESD Protection Devices

Failure Mechanism of Nickel-Chromium thin Film Chip Resistors

ESD Pulse Width Effect on RC-triggered NMOS with Power on or Off

Modeling of Transient Thermal Dissipation of Nanoscale Phase-Change Memory Cells in the Pulse Domain

Cyclic electric field stress on bipolar resistive switching devices

Environmental qualification testing and failure analysis of embedded resistors

Thermal Fatigue Damage in the Solder Joints of Leadless Chip Resistors

Internal Electrostatic Discharge Modeling: Validation and Fitting Using Tests on Insulated Wires

Analysis of Thermomechanical Stresses in Silicon During Heating of Aluminum Interconnects on its Surface by a Pulse Current

Study of Electrical Contacts Fatigue and Degradation Evaluation for Press Pack IEGT under Power Cycling Tests