Abstract:As an important basic material of electronic equipment, copper (Cu) foils should have a small thickness, good mechanical properties, and excellent thermal conductivity. However, preparing an ultrathin Cu foil with good properties remains challenging. Herein, we report an electroless deposition (ELD) strategy for the facile and scalable preparation of an ultrathin freestanding nickel-coated graphene (NCG)/Cu composite foil in a short time of 25 min. The NCG can significantly improve the mechanical and physical properties of composite foils. Experimental results reveal that the NCG/Cu composite foil manifests the best performance when the NCG concentration in an ELD bath was 30 mg/L. The composite foil evidenced a thickness of 1.1 μm, a high tensile strength of 338.7 MPa, and a high thermal conductivity of 431.2 W/mK. Compared with the pure Cu foil, both bending times and elastic modulus are increased by 298.1 and 737.3%, respectively. Remarkably, the composite foil has excellent heat dissipation performance, showing enormous potential as a heat sink material. This work proposes a new method for manufacturing the ultrathin graphene-reinforced Cu composite foil with high performance for numerous applications.The Supporting Information is available free of charge at <a class="ext-link" href="/doi/10.1021/acsami.1c01519?goto=supporting-info">https://pubs.acs.org/doi/10.1021/acsami.1c01519</a>.Microstructural characterization of GO; relationship between the bulk viscosity of the chitosan solution and standing times; elemental composition of the mapping area in <a class="internalNav" href="#fig3">Figure </a><a class="internalNav" href="#fig3">3</a>f; digital image of the flexible polyimide film and the prepared NCG/Cu composite foil; photographs of the ELD baths with different concentrations of NCG; Cu particle diameter histograms of composite foils that were produced with different concentrations of NCG; morphology and the TEM image of the composite foil prepared by adding rGO without Ni modification; characterization of the composite foil with different thickness after reacting for different times; Raman analysis of NCG and the composite foil; electrical resistivity of the composite foil with various concentrations of NCG; folding endurance of composite foils with various concentrations of NCG at different temperatures; analysis curves of the hardness and modulus of the composite foil with different concentrations of NCG; mechanical properties of the commercial electrodeposited Cu foil; specific parameters of the thermal conductive properties for the pure Cu foil and NCG/Cu foils; cross-sectional SEM image of foils for testing the heat dissipation performance (<a class="ext-link" href="/doi/suppl/10.1021/acsami.1c01519/suppl_file/am1c01519_si_001.pdf">PDF</a>)This article has not yet been cited by other publications.

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