Scalable Preparation of Ultrathin Graphene-Reinforced Copper Composite Foils with High Mechanical Properties and Excellent Heat Dissipation

Chaolong Wei,Nan Ye,Lekang Hong,Jiahui Yao,Weiyi Xia,Jie Mao,Yingjun Wang,Yuchao Zhao,Jiancheng Tang
DOI: https://doi.org/10.1021/acsami.1c01519
2021-04-28
Abstract:As an important basic material of electronic equipment, copper (Cu) foils should have a small thickness, good mechanical properties, and excellent thermal conductivity. However, preparing an ultrathin Cu foil with good properties remains challenging. Herein, we report an electroless deposition (ELD) strategy for the facile and scalable preparation of an ultrathin freestanding nickel-coated graphene (NCG)/Cu composite foil in a short time of 25 min. The NCG can significantly improve the mechanical and physical properties of composite foils. Experimental results reveal that the NCG/Cu composite foil manifests the best performance when the NCG concentration in an ELD bath was 30 mg/L. The composite foil evidenced a thickness of 1.1 μm, a high tensile strength of 338.7 MPa, and a high thermal conductivity of 431.2 W/mK. Compared with the pure Cu foil, both bending times and elastic modulus are increased by 298.1 and 737.3%, respectively. Remarkably, the composite foil has excellent heat dissipation performance, showing enormous potential as a heat sink material. This work proposes a new method for manufacturing the ultrathin graphene-reinforced Cu composite foil with high performance for numerous applications.The Supporting Information is available free of charge at <a class="ext-link" href="/doi/10.1021/acsami.1c01519?goto=supporting-info">https://pubs.acs.org/doi/10.1021/acsami.1c01519</a>.Microstructural characterization of GO; relationship between the bulk viscosity of the chitosan solution and standing times; elemental composition of the mapping area in <a class="internalNav" href="#fig3">Figure </a><a class="internalNav" href="#fig3">3</a>f; digital image of the flexible polyimide film and the prepared NCG/Cu composite foil; photographs of the ELD baths with different concentrations of NCG; Cu particle diameter histograms of composite foils that were produced with different concentrations of NCG; morphology and the TEM image of the composite foil prepared by adding rGO without Ni modification; characterization of the composite foil with different thickness after reacting for different times; Raman analysis of NCG and the composite foil; electrical resistivity of the composite foil with various concentrations of NCG; folding endurance of composite foils with various concentrations of NCG at different temperatures; analysis curves of the hardness and modulus of the composite foil with different concentrations of NCG; mechanical properties of the commercial electrodeposited Cu foil; specific parameters of the thermal conductive properties for the pure Cu foil and NCG/Cu foils; cross-sectional SEM image of foils for testing the heat dissipation performance (<a class="ext-link" href="/doi/suppl/10.1021/acsami.1c01519/suppl_file/am1c01519_si_001.pdf">PDF</a>)This article has not yet been cited by other publications.
materials science, multidisciplinary,nanoscience & nanotechnology
What problem does this paper attempt to address?
The problem that this paper attempts to solve is to prepare an ultra - thin copper foil (Cu foil) with excellent mechanical properties and high thermal conductivity. The application of traditional copper foil in electronic devices is limited by its thickness, mechanical properties and thermal conductivity. Especially with the continuous increase in the integration of modern electronic devices, the self - heating problem is becoming more and more serious, so a new type of copper foil with high thermal conductivity and high electrical conductivity is required. In addition, for the application of flexible wearable devices, traditional copper foil is prone to break during the deformation process and cannot meet the device requirements. To meet these challenges, the author proposes an electroless deposition (ELD) strategy for simple and large - scale preparation of ultra - thin nickel - coated graphene (NCG)/copper composite foil. Through this method, a composite foil with a thickness of only 1.1 micrometers can be prepared in a short time (25 minutes). This composite foil exhibits high tensile strength (338.7 MPa) and high thermal conductivity (431.2 W/mK), and no cracks appear even after 215 folds. Compared with pure copper foil, the number of bends and elastic modulus of this composite foil are increased by 298.1% and 737.3% respectively. Overall, this research aims to develop an efficient and low - cost method to prepare ultra - thin, high - performance graphene - reinforced copper composite foil to meet the higher requirements of modern electronic devices for material properties.