Effect of interface optimization and thermal cycling on thermal conductivity of laminated Cu/GO/Cu composite foils prepared by ultrasonic assisted electrodeposition and electrophoresis method

Jiaming Cao,Ke Zhan,Jianan Liu,Bin Zhao,Vincent Ji

DOI: https://doi.org/10.1016/j.matchar.2024.113888

IF: 4.537

2024-04-09

Materials Characterization

Abstract:For carbon reinforced metal matrix composites (MMCs), achieving both superior thermal conductivity (TC) and excellent thermal cycling stability has remained challenging owing to the poor interfacial bonding between carbon and metal matrix. Here, we reported an ultrasonic assisted electrodeposition and electrophoresis composite processing to fabricate Cu/GO/Cu laminated composites with Ag intermediate layer to improve the interfacial bonding and its TC. A superior in-plane TC of the Cu/Ag/GO/Ag/Cu composite (563.6 W·m −1 ·K −1 ) prepared under 0.05 mol/L Ag + concentration was achieved, which was increased by approximately 41.5% and 15.9%, comparing to pure Cu (398.2 W·m −1 ·K −1 ) and Cu/GO/Cu composite (483.6 W·m −1 ·K −1 ). Simultaneously, the influence of thermal cycling on TC and residual stress were investigated in a temperature range of −196 ~ +200 °C. The in-plane TC of Cu/Ag/GO/Ag/Cu composite was still as high as 498.5 W·m −1 ·K −1 after thermal cycling treatment for 30 times. The mechanism of high thermal properties was investigated by molecular dynamics simulation. The increased lattice thermal conductivity and interfacial bonding were responsible for it. It is expected that our work could provide an alternative method for fabricating MMCs with high TC and thermal cycling stability.

materials science, multidisciplinary,metallurgy & metallurgical engineering, characterization & testing