Molecular dynamics simulation of silicon oxidation enhanced by energetic hydrogen ion irradiation

Kohei Mizotani,Michiro Isobe,Masanaga Fukasawa,Kazunori Nagahata,Tetsuya Tatsumi,Satoshi Hamaguchi
DOI: https://doi.org/10.1088/0022-3727/48/15/152002
2015-03-25
Abstract:Molecular dynamics numerical simulations have been performed to clarify the mechanism of enhanced oxidation in Si during silicon gate etching by HBr/O2 plasmas. Such enhanced oxidation sometimes manifests itself as Si recess during gate etching processes. When a Si substrate is subject to energetic ion bombardment together with a flux of radical species, our study has identified the cause of such enhanced oxidation in Si as enhanced O diffusion arising from the momentum transfer from energetic H atoms to O atoms on the surface or in the subsurface of the Si substrate. No chemical effect such as hydrogenation of Si plays a role for the enhanced oxidation. Simulation results are found to be in good agreement with earlier experimental observations of ion-irradiation-enhanced oxidation obtained by beam experiments.
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