Abstract:The acquisition of reliable knowledge about the mechanism of short laser pulse interactions with semiconductor materials is an important step for high-tech technologies towards the development of new electronic devices, the functionalization of material surfaces with predesigned optical properties, and the manufacturing of nanorobots (such as nanoparticles) for bio-medical applications. The laser-induced nanostructuring of semiconductors, however, is a complex phenomenon with several interplaying processes occurring on a wide spatial and temporal scale. In this work, we apply the atomistic-continuum approach for modeling the interaction of an fs-laser pulse with a semiconductor target, using monolithic crystalline silicon (c-Si) and porous silicon (Si). This model addresses the kinetics of non-equilibrium laser-induced phase transitions with atomic resolution via molecular dynamics, whereas the effect of the laser-generated free carriers (electron-hole pairs) is accounted for via the dynamics of their density and temperature. The combined model was applied to study the microscopic mechanism of phase transitions during the laser-induced melting and ablation of monolithic crystalline (c-Si) and porous Si targets in a vacuum. The melting thresholds for the monolithic and porous targets were found to be 0.32 J/cm2 and 0.29 J/cm2, respectively. The limited heat conduction mechanism and the absence of internal stress accumulation were found to be involved in the processes responsible for the lowering of the melting threshold in the porous target. The results of this modeling were validated by comparing the melting thresholds obtained in the simulations to the experimental values. A difference in the mechanisms of ablation of the c-Si and porous Si targets was considered. Based on the simulation results, a prediction regarding the mechanism of the laser-assisted production of Si nanoparticles with the desired properties is drawn.

Laser grooving of semiconductor wafers: Comparing a simplified numerical approach with experiments

Transient Ablation Model for Laser Machining Polymer Microfluidic Chip

A Numerical Simulation Method for Laser Grooving

A numerical study of picosecond laser micro-grooving of single crystalline germanium: Mechanism discussion and process simulation

Multi-Physics Coupling Simulation of Picosecond Pulsed Laser Ablation of Single-Crystal Silicon

3d Finite Element Modeling Of Laser Machining Pmma

Laser cutting sandwich structure glass–silicon–glass wafer with laser induced thermal–crack propagation

Modeling of Short-Pulse Laser Interactions with Monolithic and Porous Silicon Targets with an Atomistic-Continuum Approach

Cohesive behavior of single crystalline silicon carbide scribing by nanosecond laser

Laser Grooving Technology Study at Dicing Process in Wafer Level Package

Numerical simulation and analysis on temperature field for laser melting finishing on SOI nano optical waveguide

Modeling of excimer laser ablation of silicon carbide

Simulation study on physical features of a silicon substrate during stealth dicing with a constrained interpolation profile procedure

Thermal and non-thermal ablation mechanisms in crystalline silicon by femtosecond laser pulses: classical approach of the carrier density two temperature model

Computational approach for structural and thermal behavior of laser-machined micro-grooves on alumina ceramic using ANSYS

Evolution of micro/nano-structural arrays on crystalline silicon carbide by femtosecond laser ablation

Numerical simulation and validation of subsurface modification and crack formation induced by nanosecond-pulsed laser processing in monocrystalline silicon

Study on 532-Nm Flattened Laser Beam for Silicon Wafer Grooving

Experimental investigation and optimization of femtosecond laser processing parameters of silicon carbide–based on response surface methodology

Creating extreme subsurface integrity by laser-induced material self-organization

Processing Microgrooves and Craters on the Surface of Wide Band Gap Mold Material Using Femtosecond Laser