Abstract:The high processing cost, poor mechanical properties and moderate performance of Bi2Te3–based alloys used in thermoelectric devices limit the cost-effectiveness of this energy conversion technology. Towards solving these current challenges, in the present work, we detail a low temperature solution-based approach to produce Bi2Te3-Cu2-xTe nanocomposites with improved thermoelectric performance. Our approach consists in combining proper ratios of colloidal nanoparticles and to consolidate the resulting mixture into nanocomposites using a hot press. The transport properties of the nanocomposites are characterized and compared with those of pure Bi2Te3 nanomaterials obtained following the same procedure. In contrast with most previous works, the presence of Cu2-xTe nanodomains does not result in a significant reduction of the lattice thermal conductivity of the reference Bi2Te3 nanomaterial, which is already very low. However, the introduction of Cu2-xTe yields a nearly threefold increase of the power factor associated to a simultaneous increase of the Seebeck coefficient and electrical conductivity at temperatures above 400 K. Taking into account the band alignment of the two materials, we rationalize this increase by considering that Cu2-xTe nanostructures, with a relatively low electron affinity, are able to inject electrons into Bi2Te3, enhancing in this way its electrical conductivity. The simultaneous increase of the Seebeck coefficient is related to the energy filtering of charge carriers at energy barriers within Bi2Te3 domains associated with the accumulation of electrons in regions nearby a Cu2-xTe/Bi2Te3 heterojunction. Overall, with the incorporation of a proper amount of Cu2-xTe nanoparticles, we demonstrate a 250% improvement of the thermoelectric figure of merit of Bi2Te3.

Enhanced Interfacial Adhesion and Thermal Stability in Bismuth Telluride/Nickel/Copper Multilayer Films with Low Electrical Contact Resistance

Improved contact performance and thermal stability of Co–Ni alloy barrier layer for bismuth telluride-based thermoelectric devices

Enhanced Contact Performance and Thermal Tolerance of Ni/Bi2Te3 Joints for Bi2Te3-Based Thermoelectric Devices

Ni barrier in Bi2Te3-based thermoelectric modules for reduced contact resistance and enhanced power generation properties

Effect of the interface on the mechanical properties and thermal conductivity of bismuth telluride films

EFFECT OF OPERATING TEMPERATURE ON INTERFACE DIFFUSION AND POWER GENERATION OF BISMUTH TELLURIDE THERMOELECTRIC MODULES

Stable Interconnect System for Horizontal Thermoelectric Coolers by Thermodynamic-Based Prediction

Interfacial Stability in Bi2Te3 Thermoelectric Joints

Localized Surface Doping Induced Ultralow Contact Resistance between Metal and (Bi,Sb)2Te3 Thermoelectric Films

Minimization of the electrical contact resistance in thin-film thermoelectric device

Interfacial Design Contributing to High Conversion Efficiency in Mg3(Sb, Bi)2/Bi2Te3 Thermoelectric Module with Superior Stability

Low contact resistivity and long-term thermal stability of Nb<sub>0.8</sub>Ti<sub>0.2</sub>FeSb/Ti thermoelectric junction

Effects of chemical intermixing on electrical and thermal contact conductances at metallized bismuth and antimony telluride interfaces

Multi-Interface-Induced Thermal Conductivity Reduction and Thermoelectric Performance Improvement in a Cu–Ni Alloy

Extremely Low Contact Resistivity of Bi 2 Te 3 -Based Modules Enabled by NiP-Based Alloy Barrier

Screening metal diffusion barriers for thermoelectric Bi0.5Sb1.5Te3

Fabrication and Excellent Performances of Bismuth Telluride-Based Thermoelectric Devices.

Influence of copper telluride nanodomains on the transport properties of n-type bismuth telluride

Effect of Powder ALD Interface Modification on the Thermoelectric Performance of Bismuth

Synergistically Optimized Thermoelectric and Mechanical Properties in p ‐Type BiSbTe by a Microdroplet Deposition Technique

Superior Thermal Stability of Ta/Tan Bi-Layer Structure for Copper Metallization