Abstract:W-Cu is extensively utilized as an exceptional heat sink material in high-power electronic devices. During the electronic packaging process, the surface of W-Cu demands plating with Ni or Au layers to protect the substrate and improve solderability. To enhance the bonding strength between the Ni-P coating and the W-Cu substrate, this work focused on exploring the pretreatment process for electroless nickel plating on W-Cu, with the goal of achieving a highly adhesive Ni-P coating. The effect of heat treatment on the Ni-P coating and the wetting of AgCu solder on the coating was investigated, and the growth mechanism of the Ni-P coating on the W-Cu surface was summarized. Utilizing a pretreatment process that incorporated sandblasting, hot acid pickling, and strike nickel plating. A uniform and dense strike nickel layer was obtained when pre-plated for 6 min at a current density of 3.6 A/dm2. Subsequently, the surface cells of the Ni-P coating attained through electroless plating were tightly bonded and fine, possessing optimal crystallinity. The Ni-P coating demonstrated outstanding bonding strength with the substrate, measuring 75.8 N, which increased to 83.7 N after a two-hour heat treatment at 200 degrees C. In the wettability experiment of the Ni-P coating, a reduction in surface roughness facilitated the solder wetting while coating crystallization hindered wetting. After undergoing 80 thermal shock cycles, no spalling or bubbling occurred on the surface of the as-plated and heat-treated Ni-P coating, indicating that the fabricated coating exhibited superb adhesion. This study addressed the lack of research on the pretreatment process of electroless nickel plating on the W-Cu surface, serving as a reference for electroless nickel plating on W-Cu.

Development of electro-copper plating with nanodiamonds for electronic interconnects in advanced packaging

Nano-Modification Fine-Pitch All-Copper Interconnect Technology Based on Spark Ablation

8-inch wafer-level electroplating of nanotwinned copper redistribution layer for advanced packaging

Composite electroplating to enhance the GMI output stability of melt-extracted wires

Optimization of Effective Parameters for Improving Adhesion Strength of Copper Nanowire Surface Fastener

Electroplated Copper Additives for Advanced Packaging: A Review

Electrodeposition of (111)-oriented and nanotwin-doped nanocrystalline Cu with ultrahigh strength for 3D IC application

Novel Cu-nanowire-based technology enabling fine pitch interconnects for 2.5D/3D Integration

Copper electroplating technology for microvia filling

Trench Wiring Process Applying Electroless Nickel Plating for Fine and High-Aspect-Ratio Pattern

Diamond coatings on copper surfaces through interface engineering

Electrochemical processes for the production of copper interconnects on non-metallic barrier layers

Ultra-high flatness and conductivity of copper electrodeposits obtained by nano-twinned/fine-grained double layer electrodeposition

Enhanced Interfacial Bonding in Copper/Diamond Composites via Deposition of Nano-copper on Diamond Particles

A New Cutting Wire Prepared by Copper-Diamond Composite Electroplating

Exploration of Pretreatment Process and Wettability of High Bonding Ni-P Coatings on W-Cu Composites for Electronic Packaging

Improvement of the Adhesion and Diamond Content of Electrodeposited Cu/Microdiamond Composite Coatings by a Plated Cu Interlayer

Investigation on the Electrochemical Catalysis Properties of Ni-decorated Nanoporous Copper Formed by Hybrid Laser Deposition

Electroless nickel alloy deposition on SiO2 for application as a diffusion barrier and seed layer in 3D copper interconnect technology

Improved Electrochemical Plating for Void-Free Copper Line in ULSI Interconnect

Nanotwinned Microstructure Engineering of Electroplated Copper for Enhanced Anti-corrosion in Alkaline Medium