Abstract:High-efficiency heat dissipation is crucial for the reliability and durability of high-power electronics devices. Diamond/copper composites have drawn much attention as promising candidate materials for thermal management due to their high thermal conductivity and tunable coefficient of thermal expansion. In this work, a novel method was proposed to fabricate a thin plate of diamond/copper composite based on the construction of single-layer close packed diamond particles network. The composite with a sandwich structure was prepared by press-brazing method, which is cost-effective for both preparation and post-processing. The microstructures of the composite plate containing diamond, AgCuTi filler and Cu were examined. The influence of diamond particle size on thermal conductivity, coefficient of thermal expansion, and mechanical properties were also experimentally measured and theoretically simulated. The results show that a single-layer close packed diamond particles network is densely brazed between copper layers to form a composite thin plate. The interface TiC layer is in-situ formed between diamond and AgCuTi matrix. With increase in the diamond particle size to 1200 μm, thermal conductivity of 552.7 W⋅m −1 ⋅K −1 , coefficient of thermal expansion of 10.1 × 10 -6 K −1 , and flexural strength of 204.3 MPa are achieved, which are in agreement with the theoretical simulated results. As a heat spreader substrate, the heat dissipation ability of diamond/Cu composite is increased by 5.7 °C in comparison with pure Cu plate. Finite element analysis and testing of actual scenarios further confirm the excellent thermal performance of the sandwich structured diamond/Cu composite thin plate, making it a prospective candidate for thermal management.

Enhanced Interfacial Bonding in Copper/Diamond Composites via Deposition of Nano-copper on Diamond Particles

Scalable monolayer-functionalized nanointerface for thermal conductivity enhancement in copper/diamond composite

Microstructure of Cu-diamond Composites with Near-Perfect Interfaces Prepared Via Electroplating and Its Thermal Properties

Enhanced Thermal Conductivity of Diamond/copper Composite Fabricated Through Doping with Rare-Earth Oxide Sc2O3

Synergetic effect enabling high thermal conductivity in Cu/diamond composite

Interfacial characterization and thermal conductivity of diamond/Cu composites prepared by two HPHT techniques

Preparation and Characterization of Diamond/Cu Composites

Quantitative control of interfacial structure and thermal conductivity between diamond and copper via thermal diffusion of alloying element

Microstructure and Thermal Behavior of Diamond/cu Composites: Effects of Surface Modification

Copper–micrometer-sized diamond nanostructured composites

Progress in Interface Modification and Nanoscale Study of Diamond/Cu Composites

Fabrication of diamond/copper composite thin plate based on a single-layer close packed diamond particles network for heat dissipation

Interfacial Characterization and Thermal Conductivity of Diamond/Cu Composites Prepared by Liquid-Solid Separation Technique

Progress in the Copper-Based Diamond Composites for Thermal Conductivity Applications

Thermal conduction and strength of diamond-copper composite sandwich obtained by SPS diffusion bonding with Ti interlayer

Fabrication of Titanium and Copper-Coated Diamond/Copper Composites via Selective Laser Melting

High thermal conductivity of diamond/copper composites produced with Cu–ZrC double-layer coated diamond particles

Low-temperature Densification of Diamond/cu Composite Prepared from Dual-Layer Coated Diamond Particles

Graphene Interlayer for Enhanced Interface Thermal Conductance in Metal Matrix Composites: an Approach Beyond Surface Metallization and Matrix Alloying

Critical effect and enhanced thermal conductivity of Cu-diamond composites reinforced with various diamond prepared by composite electroplating

Unveiling interfacial structure and improving thermal conductivity of Cu/diamond composites reinforced with Zr-coated diamond particles