Abstract:As a wide bandgap semiconductor, diamond has not only excellent electrical qualities but also extremely high thermal conductivity, allowing it to withstand high breakdown voltage while swiftly dissipating heat. As a result, diamond-based high-power devices are becoming increasingly popular. Cu, a transition metal with a high work function, is widely used in semiconductor microfabrication and possesses outstanding heat dissipation properties comparable to diamond. Therefore, that Cu-covered diamond is beyond the significance of ordinary electrodes. This type of metal-semiconductor contact may modify interfacial electrical features while simultaneously performing thermal design and management functions. The electrical characteristics of the Cu/diamond contact are studied using a first-principles method based on hybrid density functional theory. The Schottky barrier height of the Cu/diamond interface is 1.60 eV, according to the findings. The electron rearrangement within one or two atomic layers near the interface is revealed by the atomic layer resolved density of states and Bader charge transfer analysis, which indicates that charge reconstruction induced by the interface mainly results from metal-induced band gap states. The thermal characteristics of Cu, diamond, and Cu/ diamond interface materials are also investigated using density functional perturbation theory, anharmonic approximation, and the phonon Boltzmann transport equation. The thermal conductivities of diamond and Cu are 2501.3 and 410.4 W m-1 K-1 at room temperature, respectively. And for the Cu/diamond interface, the interfacial thermal conductance of 27.87 MW m-2 K-1 at room temperature is obtained through the Diffuse Mismatch Models. The computed value may be less than the experimental data because electron-phonon coupling contributions were not considered. Furthermore, the Hasselman-Johnson model is used to determine the relationship between the effective thermal conductivity of the Cu/diamond system and the size of the material system and the volume fraction of the diamond at room temperature. These theoretical results are consistent with the experimental results. As a result, all these results suggest that transition metal Cu as a surface coating has important applications in diamond-based high-power electronic devices.

A review of diamond interfacial modification and its effect on the properties of diamond/Cu matrix composites

Interfacial Characterization and Thermal Conductivity of Diamond/Cu Composites Prepared by Liquid-Solid Separation Technique

Effects of alloying elements on diamond/Cu interface properties based on first-principles calculations

Effects of different element coatings on the interface characteristics and thermal conductivity of vacuum-sintered diamond/Cu composites

Unveiling interfacial structure and improving thermal conductivity of Cu/diamond composites reinforced with Zr-coated diamond particles

A numerical study of the effect of interfacial thermal resistance on thermal conductivity of Cu-B/diamond composites

Progress in the Copper-Based Diamond Composites for Thermal Conductivity Applications

Manipulating in-situ discrete carbide interlayer to achieve high thermal conductivity in Cu-B/diamond composite

The Interface Design of CNTs and Cu Matrix

High thermal conductive copper/diamond composites: state of the art

Effect of titanium and zirconium carbide interphases on the thermal conductivity and interfacial heat transfers in copper/diamond composite materials

Interfacial Thermal Conductance between Cu and Diamond with Interconnected W-W 2 C Interlayer

Strengthening Mechanisms and Research Progress in the W/Cu Interfaces

Interfacial characterization and thermal conductivity of diamond/Cu composites prepared by two HPHT techniques

Exploring the Interface Structure on Interfacial Thermal Conductivity by Constructing Sandwich-like Cu/Diamond Slice/Cu Composite

Enhanced Interfacial Bonding in Copper/Diamond Composites via Deposition of Nano-copper on Diamond Particles

Graphene Interlayer for Enhanced Interface Thermal Conductance in Metal Matrix Composites: an Approach Beyond Surface Metallization and Matrix Alloying

The Microzone Structure Regulation of Diamond/Cu-B Composites for High Thermal Conductivity: Combining Experiments and First-Principles Calculations

Multi-scale study of electronic and thermal transport properties for the Cu/diamond interface

Quantitative control of interfacial structure and thermal conductivity between diamond and copper via thermal diffusion of alloying element

High thermal conductivity through interfacial layer optimization in diamond particles dispersed Zr-alloyed Cu matrix composites