Abstract:The thermal property of diamond/metal composites mainly depends on the chemical bonding and structure of interfacial layers between two heterogeneous materials. To improve the thermal property of the diamond/metal composites, a metallic carbide layer that bridging both crystal structure and thermal transport of heterogeneous interfaces is required, though the formation mechanism of such carbide interfaces during powder sintering remains under debate, particularly for the scenario of varying thermal diffusion. Here, systematic experiments of diamond/Cu–Cr composites have been conducted to unravel the effects of two important variables for thermal diffusion, temperature (800–1025 °C) and holding time (5–60 min), on the growth of chromium carbide interfaces and the resulting thermal conductivity. It is found that the main characteristics of chromium carbide layer is more related to the holding time, that is, prolonged thermal diffusion. The extraction of diamonds in as-sintered composites allows a detailed quantification of coating efficiency and crystallographic-facet-dependence of chromium carbide interfaces during diamond/metal reaction at varying temperature and holding times. It is found that the prolonged thermal diffusion is not as expected to deteriorate the thermal conductivity, and leads to a more densified structure with highest thermal conductivity instead (∼577 W/(m·K)). Furthermore, thermal diffusion of diamond/metal reaction is discussed based on theoretical models. We theoretically demonstrate that long thermal diffusion could enhance the thermal diffusivity for the composites and achieve ∼90.8% of theoretical thermal conductivity predicted by the Maxwell-Eucken model.

High thermal conductivity through interfacial layer optimization in diamond particles dispersed Zr-alloyed Cu matrix composites

Unveiling interfacial structure and improving thermal conductivity of Cu/diamond composites reinforced with Zr-coated diamond particles

High thermal conductivity of diamond/copper composites produced with Cu–ZrC double-layer coated diamond particles

High thermal conductivity Cu-3Cr/Diamond composites fabricated by powder metallurgy

Synergetic effect enabling high thermal conductivity in Cu/diamond composite

Improvement of ZrC/Zr Coating on the Interface Combination and Physical Properties of Diamond-Copper Composites Fabricated by Spark Plasma Sintering

Manipulating in-situ discrete carbide interlayer to achieve high thermal conductivity in Cu-B/diamond composite

Enhanced Thermal Conductivity in Diamond/Aluminum Composites with A Tungsten Interface Nanolayer

Preparation and thermal conductivity of C/C composites filled with diamond particles

Preparation and Characterization of Diamond/Cu Composites

Enhanced Thermal Conductivity of Diamond/aluminum Composites Through Tuning Diamond Particle Dispersion

Exploring the underlying causes of optimizing thermal conductivity of copper/diamond composites by interface thickness

Interfacial Characterization and Thermal Conductivity of Diamond/Cu Composites Prepared by Liquid-Solid Separation Technique

Realizing ultrahigh thermal conductivity in bimodal-diamond/Al composites via interface engineering

Effect of interface structure on thermal conductivity and stability of diamond/aluminum composites

Effects of different element coatings on the interface characteristics and thermal conductivity of vacuum-sintered diamond/Cu composites

Critical effect and enhanced thermal conductivity of Cu-diamond composites reinforced with various diamond prepared by composite electroplating

Thermal Conductivity of the Diamond-Cu Composites with Chromium Addition

Quantitative control of interfacial structure and thermal conductivity between diamond and copper via thermal diffusion of alloying element

Effect of titanium and zirconium carbide interphases on the thermal conductivity and interfacial heat transfers in copper/diamond composite materials

Interfacial characterization and thermal conductivity of diamond/Cu composites prepared by two HPHT techniques