Abstract:The thermal property of diamond/metal composites mainly depends on the chemical bonding and structure of interfacial layers between two heterogeneous materials. To improve the thermal property of the diamond/metal composites, a metallic carbide layer that bridging both crystal structure and thermal transport of heterogeneous interfaces is required, though the formation mechanism of such carbide interfaces during powder sintering remains under debate, particularly for the scenario of varying thermal diffusion. Here, systematic experiments of diamond/Cu–Cr composites have been conducted to unravel the effects of two important variables for thermal diffusion, temperature (800–1025 °C) and holding time (5–60 min), on the growth of chromium carbide interfaces and the resulting thermal conductivity. It is found that the main characteristics of chromium carbide layer is more related to the holding time, that is, prolonged thermal diffusion. The extraction of diamonds in as-sintered composites allows a detailed quantification of coating efficiency and crystallographic-facet-dependence of chromium carbide interfaces during diamond/metal reaction at varying temperature and holding times. It is found that the prolonged thermal diffusion is not as expected to deteriorate the thermal conductivity, and leads to a more densified structure with highest thermal conductivity instead (∼577 W/(m·K)). Furthermore, thermal diffusion of diamond/metal reaction is discussed based on theoretical models. We theoretically demonstrate that long thermal diffusion could enhance the thermal diffusivity for the composites and achieve ∼90.8% of theoretical thermal conductivity predicted by the Maxwell-Eucken model.

Synergetic effect enabling high thermal conductivity in Cu/diamond composite

Scalable monolayer-functionalized nanointerface for thermal conductivity enhancement in copper/diamond composite

Manipulating in-situ discrete carbide interlayer to achieve high thermal conductivity in Cu-B/diamond composite

High thermal conductivity of diamond/copper composites produced with Cu–ZrC double-layer coated diamond particles

High thermal conductivity through interfacial layer optimization in diamond particles dispersed Zr-alloyed Cu matrix composites

A numerical study of the effect of interfacial thermal resistance on thermal conductivity of Cu-B/diamond composites

Realizing ultrahigh thermal conductivity in bimodal-diamond/Al composites via interface engineering

Interfacial characterization and thermal conductivity of diamond/Cu composites prepared by two HPHT techniques

Unveiling interfacial structure and improving thermal conductivity of Cu/diamond composites reinforced with Zr-coated diamond particles

Quantitative control of interfacial structure and thermal conductivity between diamond and copper via thermal diffusion of alloying element

Progress in the Copper-Based Diamond Composites for Thermal Conductivity Applications

Thermal properties of tungsten/tungsten carbide-coated double-size diamond/copper composite

Interfacial Characterization and Thermal Conductivity of Diamond/Cu Composites Prepared by Liquid-Solid Separation Technique

Effect of titanium and zirconium carbide interphases on the thermal conductivity and interfacial heat transfers in copper/diamond composite materials

Preparation of bimodal-diamond/SiC composite with high thermal conductivity

Enhanced Interfacial Bonding in Copper/Diamond Composites via Deposition of Nano-copper on Diamond Particles

High thermal conductive copper/diamond composites: state of the art

High thermal conductivity Cu-3Cr/Diamond composites fabricated by powder metallurgy

Preparation of high thermal conductivity copper–diamond composites using molybdenum carbide-coated diamond particles

The Microzone Structure Regulation of Diamond/Cu-B Composites for High Thermal Conductivity: Combining Experiments and First-Principles Calculations

Enhanced Interface Phonon Thermal Conductance via Boron Addition in Copper/Diamond Composites