Reaction-Bonded Boron Nitride-Aluminum Nitride Ceramic Composites

Takao Kanai,Kei Tanemoto Kei Tanemoto,Hiroshi Kubo Hiroshi Kubo,Kei Tanemoto,Hiroshi Kubo
DOI: https://doi.org/10.1143/jjap.30.1235
IF: 1.5
1991-06-15
Japanese Journal of Applied Physics
Abstract:Hexagonal boron nitride-aluminum nitride (h-BN-AlN, 75-25 wt%) ceramic composites are synthesized by reaction bonding. Metallic component-free, relatively dense composites are obtained by using h-BN and Al as starting materials and by optimizing sintering conditions. In comparison with reaction-bonded BN, higher bending strength, 98 MPa, and higher thermal conductivity, 66 W/(m·K), are attained for a Y2O3-added BN-AlN composite. A low thermal expansion coefficient of 2.6×10-6/K is also achieved.
physics, applied
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