Abstract:To achieve high-performance thermoelectric (TE) devices, constructing a good interfacial connection between TE materials and electrodes is as important as having high figure-of-merit TE materials. Although CoSb3-based TE devices have received great attention for power generation recently, the limited long-term service stability is the main obstruct for their applications. In this work, we have prepared two kinds of Ti-based alloys (Ti83.7Al10.7Si5.6 and Ti74Ni26) as the diffusion barrier layer of CoSb3-based TE joints by the spark plasma sintering method and have systematically investigated their interfacial behaviors during the aging process. The performances of contact resistivity and mechanical strength for Ti74Ni26/Yb0.4Co3.8Fe0.2Sb12 TE joints are good before aging treatment but gradually deteriorate during the aging process, which should be ascribed to the phase-transition-induced negative thermal expansion in Ti-Ni alloys. On the other hand, Ti83.7Al10.7Si5.6/Yb0.4Co3.8Fe0.2Sb12 TE joints show both low contact resistivity (<10 μΩ·cm2) and high mechanical strength (>20 MPa) before and after 16-day aging at 500 °C, which is originated from the matching of the coefficient of thermal expansion (CTE) and the formation of network structures in Ti-Al-Si alloys. We have also prepared an eight-couple TE module of p-Ge0.9Sb0.1TeB0.01/n-Yb0.4Co3.8Fe0.2Sb12 and have measured its corresponding device performance. Our work has demonstrated that the matched CTE and network structures in the Ti-Al-Si alloy are key to obtain high-performance CoSb3-based TE joints for long-term service.

Effect of Interfacial Compound Formation on Contact Resistivity of Soldered Junctions Between Bismuth Telluride-Based Thermoelements and Copper

Interfacial Stability in Bi2Te3 Thermoelectric Joints

Effects of chemical intermixing on electrical and thermal contact conductances at metallized bismuth and antimony telluride interfaces

Interface Microstructure and Performance of Sb Contacts in Bismuth Telluride-Based Thermoelectric Elements

Interfacial Reactions between Sn-Based Solders and n-Type Bi2(Te,Se)3 Thermoelectric Material

Electroless plating of iron-group metals and electrochemical comparison for thermoelectric contacts

Polarity Effect in a Sn3Ag0.5Cu/Bismuth Telluride Thermoelectric System

Interfacial Reactions in the Sn-Bi/Te Couples

Interfacial reactions at the joints of PbTe thermoelectric modules using Ag-Ge braze

Interfacial reaction of Cu/SnPbInBiSb/Cu sandwich solder joints

Interfacial Reactions at the Joints of Cosb3-Based Thermoelectric Devices

Thermoelectric Performance of Sb2Te3-Based Alloys is Improved by Introducing PN Junctions.

Effect of Plating Layers on the Bonding Strength of p-Type Bi-Te Thermoelectric Elements

Interfacial Reaction Between Novel High Entropy Alloy SnPbInBiSb and Cu Substrate

Bonding Performance of Ag-Cu Brazing Solders and Half-Heusler Alloys for High-Performance Thermoelectric Generators.

Interfacial Reactions in Thermoelectric Modules

Enhanced Interfacial Reliability and Mechanical Strength of CoSb3-Based Thermoelectric Joints with Rationally Designed Diffusion Barrier Materials of Ti-Based Alloys

Soluble Lead and Bismuth Chalcogenidometallates: Versatile Solders for Thermoelectric Materials

Diffusion bonding at the interface of Bi2Te3 thermoelectric modules

Interface Structure and Electrical Property of Yb0.3co4sb12/Mo-Cu Element Prepared by Welding Using Ag-Cu-Zn Solder

The design of low-temperature solder alloys and the comparison of mechanical performance of solder joints on ENIG and ENEPIG interface