Formation and Device Application of Ge Nanowire Heterostructures Via Rapid Thermal Annealing

Jianshi Tang,Chiu-Yen Wang,Faxian Xiu,Yi Zhou,Lih-Juann Chen,Kang L. Wang
DOI: https://doi.org/10.1155/2011/316513
IF: 2.0981
2011-01-01
Advances in Materials Science and Engineering
Abstract:We reviewed the formation of Ge nanowire heterostructure and its field-effect characteristics by a controlled reaction between a single-crystalline Ge nanowire and Ni contact pads using a facile rapid thermal annealing process. Scanning electron microscopy and transmission electron microscopy demonstrated a wide temperature range of 400 ~ 500°C to convert the Ge nanowire to a single-crystalline Ni 2 Ge/Ge/Ni 2 Ge nanowire heterostructure with atomically sharp interfaces. More importantly, we studied the effect of oxide confinement during the formation of nickel germanides in a Ge nanowire. In contrast to the formation of Ni 2 Ge/Ge/Ni 2 Ge nanowire heterostructures, a segment of high-quality epitaxial NiGe was formed between Ni 2 Ge with the confinement of Al 2 O 3 during annealing. A twisted epitaxial growth mode was observed in both two Ge nanowire heterostructures to accommodate the large lattice mismatch in the Ni x Ge/Ge interface. Moreover, we have demonstrated field-effect transistors using the nickel germanide regions as source/drain contacts to the Ge nanowire channel. Our Ge nanowire transistors have shown a high-performance p -type behavior with a high on/off ratio of 10 5 and a field-effect hole mobility of 210 cm 2 /Vs, which showed a significant improvement compared with that from unreacted Ge nanowire transistors.
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