A Non-Invasive Pre-Bonding Screening Method for Cascaded SOA-Based Photonic Integrated Circuits

Xudong Wang,Bin Shi,Lin Liu,Yutang Ye,Yong Liu,Ripalta Stabile

DOI: https://doi.org/10.1109/psc57974.2023.10297137

2023-01-01

Abstract:We propose and experimentally verify a bonding-less non-invasive testing method for optical gain, noise and path losses of cascaded SOAs for wafer-scale photonic integrated circuit testing.

What problem does this paper attempt to address?

Non-invasive characterization of cascaded SOAs on InP-based photonic integrated circuits

Xudong Wang,Bin Shi,Lin Liu,Desalegn Wolde Feyisa,Juanxiu Liu,Shangjian Zhang,Yutang Ye,Yong Liu,Ripalta Stabile

DOI: https://doi.org/10.1364/oe.534638

IF: 3.8

2024-09-21

Optics Express

Abstract:Xudong Wang, Bin Shi, Lin Liu, Desalegn Wolde Feyisa, Juanxiu Liu, Shangjian Zhang, Yutang Ye, Yong Liu, Ripalta Stabile Semiconductor optical amplifiers (SOAs) are widely used as active elements in optical switching networks for their features of loss ... [Opt. Express 32, 36021-36030 (2024)]

optics
Optical Investigations of Directly Wafer-Bonded InP–GaAs Heterojunctions

Yan-Feng Lao,Hui-Zhen Wu,Meng Cao,Chun-Fang Cao

DOI: https://doi.org/10.1149/1.3071521

IF: 3.9

2009-01-01

Journal of The Electrochemical Society

Abstract:The optical characteristics of directly wafer-bonded InP-GaAs heterojunctions have been investigated. By designing the bonding interface at standing-wave antinode. its influence on optical performances of bonded structures is magnified, which facilitates experimental detection using optical methods. Wavelength blueshift and reflectivity falling at the resonance mode were observed in water-bonded InP-GaAs heterostructures. Numerical analysis suggests that two effects involving thickness change of interfacial bonding layers and extra optical loss introduced by bonded junctions are responsible for the experimental observations. and these effects can be attenuated by lowering anneal temperatures and incorporating an InP/InGaAsP superlattice into the surface of InP-based materials. The results are useful for designing effective optical characteristics of wafer-bonded device Structures. (c) 2009 The Electrochemical Society. [DOI: 10.1149/1.3071521] All rights reserved.
A Contactless Testing Methodology for Pre-Bond Interposer

Jianfei Jiang,Weiguang Sheng,Qin Wang,Zhigang Mao

DOI: https://doi.org/10.1109/mwscas.2015.7282074

2015-01-01

Abstract:Silicon interposer based 2.5D IC is a promising solution for providing low interconnect delay, high bandwidth, and heterogeneous integration. It has been considered as an alternative of the 3D technology. However, testing is a big issue in 2.5D IC. This paper presents a new contactless testing mechanism for pre-bond interposer testing. Our testing mechanism attempts to detect a defective interposer from the contactless coupling. Interposer with capacitive coupling testing structure is modeled in EM solver. Simulation is carried out to verify our proposed testing methodology. The simulation results show that the proposed pre-bond interposer testing scheme can detect a defective interposer.
Menis Siob Design For Integrated Transceiver Application

Yr Yang,Ym Cai,Yl Wang,Jy Yang,Ym Wu,L Luo,Xq Sun

DOI: https://doi.org/10.1117/12.519922

2004-01-01

Abstract:A novel self-aligning SIOB (SIlicon Optical Bench) for fully passive alignment of optical components is proposed for integrated transceiver modules. The coupling efficiency from laser diode directly to fiber is about 8%(1) in theory because of severe mode mismatch and large NA difference. To pursue high coupling efficiency, a ball lens is added between laser diode and fiber. The calculations and simulations are done to optimize the optical system according to optical component specifications. The coupling efficiency is up to 45%. We designed the layout and fabricated the SIOB in (100) silicon wafer to obtain the demanding cavities by MEMS technology.
On-chip hybrid integration of swept frequency distributed-feedback laser with silicon photonic circuits using photonic wire bonding

Sheri Jahan Chowdhury,Kithmin Wickremasinghe,Samantha M. Grist,Hang Zou,Matthew Mitchell,Mohammed A. Al-Qadasi,Becky Lin,Davin Birdi,Shannon Smythe,Sudip Shekhar,Karen C. Cheung,Lukas Chrostowski

DOI: https://doi.org/10.1364/oe.510036

IF: 3.8

2024-01-18

Optics Express

Abstract:Sheri Jahan Chowdhury, Kithmin Wickremasinghe, Samantha M. Grist, Hang Zou, Matthew Mitchell, Mohammed A. Al-Qadasi, Becky Lin, Davin Birdi, Shannon Smythe, Sudip Shekhar, Karen C. Cheung, Lukas Chrostowski This paper presents a novel co-packaging approach through on-chip hybrid laser integration with photonic circuits using photonic wire ... [Opt. Express 32, 3085-3099 (2024)]

optics
AtOMICS: A neural network-based Automated Optomechanical Intelligent Coupling System for testing and characterization of silicon photonics chiplets

Jaime Gonzalo Flor Flores,Connor Nasseraddin,Jim Solomon,Talha Yerebakan,Andrey B. Matsko,Chee Wei Wong

DOI: https://doi.org/10.48550/arXiv.2210.16946

2022-10-31

Abstract:Recent advances in silicon photonics promise to revolutionize modern technology by improving performance of everyday devices in multiple fields. However, as the industry moves into a mass fabrication phase, the problem of effective testing of integrated silicon photonics devices remains to be solved. A cost-efficient manner that reduces schedule risk needs to involve automated testing of multiple devices that share common characteristics such as input-output coupling mechanisms, but at the same time needs to be generalizable to multiple types of devices and scenarios. In this paper we present a neural network-based automated system designed for in-plane fiber-chip-fiber testing, characterization, and active alignment of silicon photonic devices that use process-design-kit library edge couplers. The presented approach combines state-of-the-art computer vision techniques with time-series analysis, in order to control a testing setup that can process multiple devices and can be easily tuned to incorporate additional hardware. The system can operate at vacuum or atmospheric pressures and maintains stability for fairly long time periods in excess of a month.

Image and Video Processing,Applied Physics
Compact Modeling and Circuit-Level Simulation of Silicon Nanophotonic Interconnects.

Rui Wu,Yuyang Wang,Zeyu Zhang,Chong Zhang,Clint L. Schow,John E. Bowers,Kwang-Ting Cheng

DOI: https://doi.org/10.23919/date.2017.7927057

2017-01-01

Abstract:Nanophotonic interconnects have been playing an increasingly important role in the datacom regime. Greater integration of silicon photonics demands modeling and simulation support for design validation, optimization and design space exploration. In this work, we develop compact models for a number of key photonic devices, which are extensively validated by the measurement data of a fabricated optical network-on-chip (ONoC). Implemented in SPICE-compatible Verilog-A, the models are used in circuit-level simulations of full optical links. The simulation results match well with the measurement data. Our model library and simulation approach enable the electro-optical (EO) co-simulation, allowing designers to include photonic devices in the whole system design space, and to co-optimize the transmitter, interconnect, and receiver jointly.
Wafer and chip-level characterization of edge-coupled photonic integrated circuits by cascaded grating couplers and spot-size converters

Moataz Eissa,Ryuya Sasaki,Tsuyoshi Horikawa,Tomohiro Amemiya,Nobuhiko Nishiyama

DOI: https://doi.org/10.35848/1347-4065/ad5fd5

IF: 1.5

2024-07-25

Japanese Journal of Applied Physics

Abstract:This study presents an efficient testing process for characterizing silicon photonic ICs. This process utilizes a coupling structure that integrates grating couplers and spot-size converters for efficient testing both at the chip and wafer levels, respectively. By leveraging wafer-level testing to estimate the characteristics of final chip-level devices, we anticipate a reduction in testing costs. To demonstrate the validity of the proposed testing process, we fabricated and measured silicon-on-insulator ring resonator devices on both wafer and chip levels. The results showed good agreement between the two levels of measurement, validating the effectiveness of our proposed testing process.

physics, applied
Soft-Lithography-Based Inter-Chip Optical Interconnection Circuit

Wei Ni,Xingkun Wu

DOI: https://doi.org/10.3321/j.issn:0253-2239.2007.05.011

2007-01-01

Abstract:A soft-lithography based optical interconnection circuit for inter-chip communications on printed circuit board (PCB) was designed, fabricated and characterized. A novel circuit termination coupler was proposed, capable of easing the coupling between transceiver and waveguide significantly and reducing the demand for installing precision, and it was found that an optimum coupling was achieved at a ratio of 12:1 between the lengths of beam duct and entrance/exit window. The fundamental circuit layout criteria were analyzed for waveguide intersections, and the crosstalks between crossed waveguides were calculated as a function of both various waveguide cross-sections and crossing angles. It was found that cross-talk would be lower than-30 dB for crossing angles greater than 54° in the case of strong bounding. Polymer devices for optical interconnection circuit are fabricated experimentally. Experimental measurement for both coupling structure and cross-over circuit elements were compared with calculated results and a reasonably good agreement was obtained. In contrast with traditional lithography or laser direct writing, soft lithography features a simple fabrication process and high-precision duplication of polymer three-dimensional structure in quantity.
Hybrid Integration of High-Speed MUTC-PD on SOI

Enfei Chao,Bing Xiong,Changzheng Sun,Zhibiao Hao,Lai Wang,Jian Wang,Yanjun Han,Hongtao Li,Jiadong Yu,Yi Luo

DOI: https://doi.org/10.1117/12.2543930

2019-01-01

Abstract:A hybrid integration method of back-illuminated modified uni-traveling carrier photodiode (MUTC-PD) on silicon-on-insulator (SOI) is demonstrated. Compared with the die-to-die bonding of unprocessed III-V die, this hybrid bonding method, implemented by a flip-chip bonding machine, is more convenient and flexible, thus providing a more direct path to utilizing high-speed PDs in integrated microwave photonics on SOI. As a result, the integrated photodetector exhibits a 3-dB bandwidth of 30 GHz, showing no degradation compared with the bandwidth before bonding.
Study of InP/SOI Wafer Bonding Based on Wet Surface Activation Treatment

Kewei GONG,Changzheng SUN,Bing XIONG

DOI: https://doi.org/10.16818/j.issn1001-5868.2018.01.012

2018-01-01

Abstract:Direct InP/SOI wafer bonding based on wet surface treatment was investigated to realize Si-based lasers.In this study,diluted HF solution was used to activate the InP wafer surface,while Piranha solution was adopted for SOI wafer,thus enabling low-temperature direct wafer bonding between InP and SOI.Crack-open method and scratch tester were employed to analyze the bonding strength of the bonded samples.In addition,scanning acoustic microscope and scanning electron microscope were also used to evaluate the defects at the bonding interface and the cross-section of the bonded samples.The measurement results show that the proposed method can achieve satisfactory bonding results.
A Novel Soft-Lithography Based Coupling Structure For Optical Interconnection

Junhao Wu,Junfeng Bao,Xiang Wu

DOI: https://doi.org/10.1117/12.667012

2006-01-01

Abstract:Optical interconnections on printed circuit board (PCB) holds the promise to meet an ever-increasing demand for inter-chip interconnect bandwidth, while the requirement of a stringent alignment between transmitter (normally VCSEL) and the waveguide on PCB exhibits one of obstacles that prohibit immediate implementation of optical interconnections. We demonstrate in this paper a soft lithography based coupling structure with a 0.5x0.5 mm pick-up window interfacing to VCSEL, along with a beam duct connecting to a regular waveguide. The coupling head, beam duct and the regular waveguide for chip-chip transmission were monolithically fabricated with UV-cured optical polymers through a single soft lithography process. The optical alignment was greatly eased by a factor of four comparing with conventional coupling approaches of straight waveguides. The coupling efficiency of the structure was compared with those of two prior schemes by utilizing ZEMAX, and change in transmitted pulse shape due to different beam path length was also analyzed. It was found that time delay as a result of an increased size of coupling structure was only in the order of 10-12 second, suitable for high speed communications in the range of 10Gb/s.
Integrated Automatic Optical Inspection and Image Processing Procedure for Smart Sensing in Production Lines

Rong-Qing Qiu,Mu-Lin Tsai,Yu-Wen Chen,Shivendra Pratap Singh,Cheng-Yao Lo

DOI: https://doi.org/10.3390/s24051619

IF: 3.9

2024-03-02

Sensors

Abstract:An integrated automatic optical inspection (iAOI) system with a procedure was proposed for a printed circuit board (PCB) production line, in which pattern distortions and performance deviations appear with process variations. The iAOI system was demonstrated in a module comprising a camera and lens, showing improved supportiveness for commercially available hardware. The iAOI procedure was realized in a serial workflow of image registration, threshold setting, image gradient, marker alignment, and geometric transformation; furthermore, five operations with numerous functions were prepared for image processing. In addition to the system and procedure, a graphical user interface (GUI) that displays sequential image operation results with analyzed characteristics was established for simplicity. To demonstrate its effectiveness, self-complementary Archimedean spiral antenna (SCASA) samples fabricated via standard PCB fabrication and intentional pattern distortions were demonstrated. The results indicated that, compared with other existing methods, the proposed iAOI system and procedure provide unified and standard operations with efficiency, which result in scientific and unambiguous judgments on pattern quality. Furthermore, we showed that when an appropriate artificial intelligence model is ready, the electromagnetic characteristic projection for SCASAs can be simply obtained through the GUI.

engineering, electrical & electronic,chemistry, analytical,instruments & instrumentation
A Novel Nontraditional Approach to C2W Cu/SiO2 Hybrid Bonding

Han Jiang,Ziyu Liu,Chen Lin,Chuandong Li,Zeyu Ning,Lin Chen,Jeff Xu,Qingqing Sun

DOI: https://doi.org/10.1109/icept63120.2024.10668515

2024-01-01

Abstract:Chip-to-wafer (C2W) hybrid bonding is a promising technology in the three-dimensional integrated circuit (3D IC) area. For C2W Cu/SiO 2 hybrid bonding, the hydrophilic SiO 2 -SiO 2 pre-bonding step is very important because low pre-bonding strength will result in the hybrid bonding failure during the subsequent annealing process. Traditionally, ultralow dielectric surface roughness needs to be achieved through precisely controlled chemical mechanical polishing (CMP) to ensure good direct bonding quality. In this study, we proposed nontraditional pre-bonding process conditions by applying heat and high pressure simultaneously to relax the strict CMP process requirement for hybrid bonding. By using this unconventional pre-bonding approach, successful C2W Cu/SiO 2 hybrid bonding with high shear strength can be potentially achieved even with poor SiO 2 surface roughness. Various characterization experiments were performed to confirm the effectiveness of this nontraditional pre-bonding method.
Self-test methodology and structures for pre-bond TSV testing in 3D-IC system

chao wang,jun zhou,bin zhao,xin liu,philippe royannez,minkyu je

DOI: https://doi.org/10.1109/ASSCC.2012.6570808

2012-01-01

Abstract:This paper presents a self-test methodology and test structures for testing Through Silicon Vias (TSVs) in 3D-IC system prior to stacking in order to improve overall yield. A Scan Switch Network (SSN) architecture is proposed to perform pre-bond TSV scan testing. In the SSN, novel self-test structures are proposed and integrated to detect TSV defects by stuck-atfault and delay-based tests. By exploiting the inherent delay characteristics of TSV, the variation of TSV-to-substrate resistance caused by TSV defects can be mapped to a path delay change and detected. Compared with prior works, the proposed test architecture addresses pre-bond TSV testing under an integrated test solution with low overhead. Test chip measurement and analysis are presented to verify the proposed self-test methodology and structures.
Photonic-assisted Seamless Channelization Based on Integrated Three-Stage Cascaded DIs

Jingjing Wang,Minghua Chen,Hongchen Yu,Yunhua Liang,Hongwei Chen,Sigang Yang,Shizhong Xie

DOI: https://doi.org/10.1109/mwp.2013.6724009

2013-01-01

Abstract:A novel photonic-assisted approach to realize seamless channelization based on silicon-on-insulator (SOI) integrated cascaded delay interferometers (DIs) is proposed and demonstrated. In this approach, cascaded DIs provides uniform spaced filters for different channels and a flat optical frequency comb (OFC) is used as local oscillator (LO) for frequency down-conversion. Since the frequency spacing of OFC is set to be twice of channel interval and IQ demodulation scheme is employed, cross talk from different channels can be eliminated. In addition, we designed the overlapped position of the two adjacent channels to be just 3dB lower than the filter peak for covering the whole spectrum seamlessly. This new concept has been testified with an experimental 8-channel receiver of 12.8-GHz bandwidth.
A Cost-Effective Pre-Bond Functional Test Architecture for 3d Socs

Xiangwei Huang,Pu Pang,Xiaoyao Liang,Li Jiang

DOI: https://doi.org/10.1109/icam.2016.7813601

2016-01-01

Abstract:We proposed a novel pre-bond functional test architecture for core -level partitioned 3D SoCs. In this test architecture, a new test access mechanism is built by probing functional Through Silicon Vias (TSVs) and by linking functional TSVs to all pins of IP cores under test. In order to reduce the Design-for-Test (DfT) cost, we propose a novel scheme to share the functional TSVs among pins of IP cores and reuse wires which connect pins to the same functional TSVs. Experimental results based on the MCNC benchmarks circuits demonstrate the feasibility and effectiveness of the DfT optimization methods.
Hybrid Integration of End-To-End Optical Interconnects on Printed Circuit Boards

Zhaoran Rena Huang,Daniel Guidotti,Lixi Wan,Yin-Jung Chang,Jianjun Yu,Jin Liu,Hung-Fei Kuo,Gee-Kung Chang,Fuhan Liu,Rao R. Tummala

DOI: https://doi.org/10.1109/tcapt.2007.901757

2007-01-01

IEEE Transactions on Components and Packaging Technologies

Abstract:This paper discusses the integration of an end-to-end optical interconnect testbed on printed circuit boards using inexpensive off-the-shelf, bare die, optoelectronic components. We developed a process for efficient and simultaneous in-plane optical coupling between edge emitting laser and waveguides, and between photodetector and waveguide. We demonstrated an optically smooth buffer layer separating the printed circuit layer from the optical transport layer. The demonstrated radically new optical interconnect technology, which we refer to as interface optical coupling, is able to efficiently and simultaneously form optical interfaces between waveguides, lasers and photodetectors by photolithographic technique, thereby eliminating the need for micro-lenses and manual alignment. The measured laser to waveguide coupling efficiency is 45% and measured waveguide to photodetector coupling is 35%. The optical link is demonstrated to operate at 10 Gbps.
Investigation of Evanescent Coupling Between SOI Waveguides and Heterogeneously-Integrated III–V Pin Photodetectors

Zhen Sheng,Liu,Joost Brouckaert,Sailing He,Dries Van Thourhout,Roel Baets

DOI: https://doi.org/10.1109/iciprm.2009.5012467

2009-01-01

Abstract:Integrating III-V materials on Si is a promising candidate to realize both passive and active optical functions on a single silicon chip. We have developed this heterogeneous integration technology by means of an adhesive die-to-wafer bonding process under a low temperature. In this paper, efficient evanescent coupling between SOI waveguides and heterogeneously-integrated III-V pin photodetectors is proposed. The serious absorption by p-InGaAs and metal contact layers are greatly reduced by introducing a central opening on these layers. The thickness of the i-InGaAs layer is also optimized towards efficient absorption.
Hybrid integration of silicon photonics circuits and InP lasers by photonic wire bonding

Muhammad Rodlin Billah,Matthias Blaicher,Tobias Hoose,Philipp-Immanuel Dietrich,Pablo Marin-Palomo,Nicole Lindenmann,Aleksandar Nesic,Andreas Hofmann,Ute Troppenz,Martin Moehrle,Sebastian Randel,Wolfgang Freude,Christian Koos

DOI: https://doi.org/10.1364/OPTICA.5.000876

2018-02-10

Abstract:Efficient coupling of III-V light sources to silicon photonic circuits is one of the key challenges of integrated optics. Important requirements are low coupling losses, as well as small footprint and high yield of the overall assembly, along with the ability to use automated processes for large-scale production. In this paper, we demonstrate that photonic wire bonding addresses these challenges by exploiting direct-write two-photon lithography for in-situ fabrication of three-dimensional freeform waveguides between optical chips. In a series proof-of-concept experiments, we connect InP-based horizontal-cavity surface emitting lasers (HCSEL) to passive silicon photonic circuits with insertion losses down to 0.4 dB. To the best of our knowledge, this is the most efficient interface between an InP light source and a silicon photonic chip that has so far been demonstrated. Our experiments represent a key step in advancing photonic wire bonding to a universal integration platform for hybrid photonic multi-chip assemblies that combine known-good dies of different materials to high-performance hybrid multi-chip modules.

Applied Physics,Optics

A Non-Invasive Pre-Bonding Screening Method for Cascaded SOA-Based Photonic Integrated Circuits

Non-invasive characterization of cascaded SOAs on InP-based photonic integrated circuits

Optical Investigations of Directly Wafer-Bonded InP–GaAs Heterojunctions

A Contactless Testing Methodology for Pre-Bond Interposer

Menis Siob Design For Integrated Transceiver Application

On-chip hybrid integration of swept frequency distributed-feedback laser with silicon photonic circuits using photonic wire bonding

AtOMICS: A neural network-based Automated Optomechanical Intelligent Coupling System for testing and characterization of silicon photonics chiplets

Compact Modeling and Circuit-Level Simulation of Silicon Nanophotonic Interconnects.

Wafer and chip-level characterization of edge-coupled photonic integrated circuits by cascaded grating couplers and spot-size converters

Soft-Lithography-Based Inter-Chip Optical Interconnection Circuit

Hybrid Integration of High-Speed MUTC-PD on SOI

Study of InP/SOI Wafer Bonding Based on Wet Surface Activation Treatment

A Novel Soft-Lithography Based Coupling Structure For Optical Interconnection

Integrated Automatic Optical Inspection and Image Processing Procedure for Smart Sensing in Production Lines

A Novel Nontraditional Approach to C2W Cu/SiO2 Hybrid Bonding

Self-test methodology and structures for pre-bond TSV testing in 3D-IC system

Photonic-assisted Seamless Channelization Based on Integrated Three-Stage Cascaded DIs

A Cost-Effective Pre-Bond Functional Test Architecture for 3d Socs

Hybrid Integration of End-To-End Optical Interconnects on Printed Circuit Boards

Investigation of Evanescent Coupling Between SOI Waveguides and Heterogeneously-Integrated III–V Pin Photodetectors

Hybrid integration of silicon photonics circuits and InP lasers by photonic wire bonding