Abstract:The increasing performance of microprocessors leads to higher bandwidth requirements for the data flow to and from the processor. Today, all signaling on a PCB is performed electrically, using copper lines that are integrated in the board. However, issues such as propagation loss and inter-channel crosstalk limit the scalability of electrical interconnects to ever higher bandwidth densities. Optical interconnects feature a higher bandwidth x length product, are more power-efficient and enable a higher bandwidth density than electrical interconnects do. This paper describes a kind of two-dimensional monolayer optical interconnects providing interconnections between chips on conventional PCB. We have designed a soft-lithography-based, versatile coupling structure with a 45 degrees total internal reflector (TIR), a beam duct, and a polymer waveguide in order to vertically couple light beams between transmitter (or receiver) and the waveguide layer. This proposed integrated architecture of a polymeric optical interconnection has been demonstrated to be advantageous in the aspects of misalignment tolerance, ease and low cost of fabrication, as well as relative simplicity in deployment. We also investigated the characteristics of in-plane connections including cross-over and branching nodes in the optical interconnects with experimental and theoretical analysis. The theoretical crosstak as calculated by a function of crossing angle, was determined for a set of interconnect pairs with varying cross-sections, and was compared with experimental measurements. Furthermore, a suitable branching angle was found for branching node and the effects of short-distance mode scrambling in highly multimode polymer waveguides were studied in detail in this paper too.

A Novel Soft-Lithography Based Coupling Structure For Optical Interconnection

Soft-Lithography-Based Inter-Chip Optical Interconnection Circuit

Soft-Lithography-Based Inter-Chip Optical Interconnects

Interlayer Slope Waveguide Coupler for Multilayer Chalcogenide Photonics

Efficient coupler between chip-level and board-level optical waveguides.

High-efficiency Grating Coupler Based on Fast Directional Optimization and Robust Layout Strategy in 130 Nm CMOS Process.

High Density Vertical Optical Interconnects for Passive Assembly

Optical Interconnection Technology on Electro/Optical Pcb (Eopcb)

Development of Silicon Photonic Devices for Optical Interconnects

Hybrid Integration of End-To-End Optical Interconnects on Printed Circuit Boards

Layer-to-layer Optical Interconnect Coupling by Soft-Lithographic Stamping

Free-form micro-optics enabling ultra-broadband low-loss fiber-to-chip coupling

Optical Interconnection in Embedded-Fiber Printer Circuit Boards

Efficient Hybrid Integration of Long-Wavelength VCSELs on Silicon Photonic Circuits

Design and Analysis of A Highly Efficient Coupler Between A Micro/Nano Optical Fiber and an Soi Waveguide

Efficient Fiber to Waveguide Coupling Structure for Optical Systems Integration Using Grayscale Lithography

Alignment-free photonic interconnects

3D Polymer Directional Coupler for On-Board Optical Interconnects at 1550 Nm.

Compact ultra-broadband light coupling on chip via nonadiabatic pumping

Efficient coupling between an integrated photonic waveguide and an optical fiber

Ultra-Compact Coupling Structures for Heterogeneously Integrated Silicon Lasers