Chip-To-Chip Optical Interconnects Based on Flexible Integrated Photonics

Lan Li,Yi Zou,Hongtao Lin,Juejun Hu,Xiaochen Sun,Ning-Ning Feng,Sylvain Danto,Kathleen Richardson,Tian Gu,Michael Haney
DOI: https://doi.org/10.1117/12.2037812
2014-01-01
Abstract:A high bandwidth density chip-to-chip optical interconnect architecture is analyzed. The interconnect design leverages our recently developed flexible substrate integration technology to circumvent the optical alignment requirement during packaging. Initial experimental results on fabrication and characterization of the flexible photonic platform are also presented.
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