Exploration of Electrical and Novel Optical Chip-to-Chip Interconnects

Wulong Liu,Yu Wang,Xue Feng,Yidong Huang,Huazhong Yang,Yuan Xie,Guoqing Chen
DOI: https://doi.org/10.1109/MDAT.2014.2336217
2014-01-01
Abstract:Off-chip interconnect is often a bottleneck due to its limited number of pins and bandwidth. The authors present an optical orbital angular momentum (OAM)-based wireless interchip interconnect and compare it with traditional electrical and optical interconnect alternatives.
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