Abstract:Networks-on-chip (NoC) is emerging as a key on-chip communication architecture for multiprocessor systems-on-chip (MPSoC). In traditional electronic NoCs, high bandwidth can be obtained by increasing the number of parallel metallic wires at the cost of more energy consumption. Optical NoCs are thus proposed to achieve low-power ultra-high-bandwidth data transmission in optical domain. Electronic control technology could be a complement to the optical networks. Besides NoCs, three-dimensional integrated circuits (3D ICs) are another attractive solution for system performance improvement by reducing the interconnect length. The investigation of using 3D IC as a platform for the realization of mixed-technology electronic-con trolled optical NoC has not been addressed until recently. In this paper, we propose a 3D electronic-controlled optical NoC implemented in a TSV-based (through-silicon via) two-layer 3D chip. The upper device layer is an optical layer. It integrates an optical data transmission network, which is responsible for optical payload packets transmission. The bottom device layer is an electronic layer. It contains an electronic control network, which Is used to route control packets and configure the optical network. We built an M mesh-based 3D optical NoC, with a 45nm electronic control network. Power comparison with a matched 2D electronic NoC shows that the optical NoC can reduce power consumption significantly. For 2048B packets, it has a 70% power reduction. End-to-end delay (ETE delay) and network throughput of the two NoCs under varying injection rates were evaluated for comparison. The results show that ETE delay of the optical NoC is much smaller than the electronic NoC when the network becomes congested. Take 4096B packets for example, it is 18.7 mu s in the optical NoC with an injection rate of 0.5, while 33.5 mu s in the electronic one. A maximum throughput of 478Gbps can be offered by the optical NoC using 32Gbps optical link bandwidth. Because of the low resource utilization of circuit switching, the maximum throughput of the optical NoC is slightly lower than the electronic one.

Design and Evaluation of Virtual Channel-Based Optical-Electrical Interface for Optical Network-on-Chip

A Novel Virtual-Cluster Based Architecture of Double-Layer Optical Networks-on-Chip

Silicon Photonic Network-on-chip and Enabling Components

Thermal Aware Design Method for VCSEL-Based On-Chip Optical Interconnect

An Inter/Intra-Chip Optical Network for Manycore Processors

Simulation approach of hybrid optical-electrical on-chip interconnects for multicore systems

A novel micro-ring-based 4 × 4 non-blocking silicon optical router

3d Optical Networks-On-Chip (Noc) For Multiprocessor Systems-On-Chip (Mpsoc)

Integrated Nanophotonic Devices for Optical Interconnections

Energy-Efficient Hybrid Optical-Electronic Network-On-Chip for Future Many-Core Processors

Thermal-Aware Design and Simulation Approach for Optical NoCs

Design and Evaluation of an Arbitration-Free Passive Optical Crossbar for On-Chip Interconnection Networks

100 Gb/s VCSEL Based Optical Interconnects Enabled by Multimode Full-Link Optimization

3-D Mesh-Based Optical Network-on-Chip for Multiprocessor System-on-Chip

Electrical and optical on-chip interconnects in scaled microprocessors

Compact Modeling and Circuit-Level Simulation of Silicon Nanophotonic Interconnects.

Alleviate Chip I/O Pin Constraints for Multicore Processors Through Optical Interconnects.

Optical Uplink, D2D and IoT Links Based on VCSEL Array: Analysis and Demonstration

Work-in-Progress: Communication Optimization for Thermal Reliable Optical Network-on-Chip

On-chip Optical Interconnect for Reduced Delay Uncertainty