Abstract:The increasing performance of microprocessors leads to higher bandwidth requirements for the data flow to and from the processor. Today, all signaling on a PCB is performed electrically, using copper lines that are integrated in the board. However, issues such as propagation loss and inter-channel crosstalk limit the scalability of electrical interconnects to ever higher bandwidth densities. Optical interconnects feature a higher bandwidth x length product, are more power-efficient and enable a higher bandwidth density than electrical interconnects do. This paper describes a kind of two-dimensional monolayer optical interconnects providing interconnections between chips on conventional PCB. We have designed a soft-lithography-based, versatile coupling structure with a 45 degrees total internal reflector (TIR), a beam duct, and a polymer waveguide in order to vertically couple light beams between transmitter (or receiver) and the waveguide layer. This proposed integrated architecture of a polymeric optical interconnection has been demonstrated to be advantageous in the aspects of misalignment tolerance, ease and low cost of fabrication, as well as relative simplicity in deployment. We also investigated the characteristics of in-plane connections including cross-over and branching nodes in the optical interconnects with experimental and theoretical analysis. The theoretical crosstak as calculated by a function of crossing angle, was determined for a set of interconnect pairs with varying cross-sections, and was compared with experimental measurements. Furthermore, a suitable branching angle was found for branching node and the effects of short-distance mode scrambling in highly multimode polymer waveguides were studied in detail in this paper too.

A fully-integrated flexible photonic platform for chip-to-chip optical interconnects

Chip-To-Chip Optical Interconnects Based on Flexible Integrated Photonics

A universal approach for photonic integration on flexible substrates

Flexible integrated photonics: where materials, mechanics and optics meet [Invited]

Flexible Passive Integrated Photonic Devices with Superior Optical and Mechanical Performance.

Flexible Integrated Photonic Devices and Applications

Integrated Flexible Chalcogenide Glass Photonic Devices

Integrated Photonics Put at Full Stretch: Flexible and Stretchable Photonic Devices Enabled by Optical and Mechanical Co-Design

Substrate-blind Photonic Integration Based on High-Index Glass Materials

Silicon Photonic Network-on-chip and Enabling Components

Substrate-blind Photonic Integration

A Universal Approach to High-Index-Contrast Flexible Integrated Photonics

Photonic Chiplet Interconnection via 3D-Nanoprinted Interposer

Soft-Lithography-Based Inter-Chip Optical Interconnects

Interlayer Slope Waveguide Coupler for Multilayer Chalcogenide Photonics

Hybrid Integrated Photonic Platforms: Feature Issue Introduction

Hybrid Integration of End-To-End Optical Interconnects on Printed Circuit Boards

(Invited) Mechanically Flexible Integrated Photonic Systems for Sensing and Communications

Ultracompact and multifunctional integrated photonic platform

Stretchable Integrated Microphotonics

3D Integrated Photonics Platform with Deterministic Geometry Control