Abstract:The field of integrated photonics has advanced rapidly due to wafer-scale fabrication, with integrated-photonics platforms and fabrication processes being demonstrated at both infrared and visible wavelengths. However, these demonstrations have primarily focused on fabrication processes on silicon substrates that result in rigid photonic wafers and chips, which limit the potential application spaces. There are many application areas that would benefit from mechanically-flexible integrated-photonics wafers, such as wearable healthcare monitors and pliable displays. Although there have been demonstrations of mechanically-flexible photonics fabrication, they have been limited to fabrication processes on the individual device or chip scale, which limits scalability. In this paper, we propose, develop, and experimentally characterize the first 300-mm wafer-scale platform and fabrication process that results in mechanically-flexible photonic wafers and chips. First, we develop and describe the 300-mm wafer-scale CMOS-compatible flexible platform and fabrication process. Next, we experimentally demonstrate key optical functionality at visible wavelengths, including chip coupling, waveguide routing, and passive devices. Then, we perform a bend-durability study to characterize the mechanical flexibility of the photonic chips, demonstrating bending a single chip 2000 times down to a bend diameter of 0.5 inch with no degradation in the optical performance. Finally, we experimentally characterize polarization-rotation effects induced by bending the flexible photonic chips. This work will enable the field of integrated photonics to advance into new application areas that require flexible photonic chips.

Stretchable Integrated Microphotonics

Integrated Photonics Put at Full Stretch: Flexible and Stretchable Photonic Devices Enabled by Optical and Mechanical Co-Design

Monolithically Integrated Stretchable Photonics

(Invited) Mechanically Flexible Integrated Photonic Systems for Sensing and Communications

Monolithic High-Index-Contrast Stretchable Photonics

Flexible Integrated Photonic Devices and Applications

Flexible integrated photonics: where materials, mechanics and optics meet [Invited]

A universal approach for photonic integration on flexible substrates

Flexible Passive Integrated Photonic Devices with Superior Optical and Mechanical Performance.

Research Progress On Flexible Photonic Materials And Devices

Integrated Flexible Chalcogenide Glass Photonic Devices

A New Twist on Glass: A Brittle Material Enabling Flexible Integrated Photonics

Amorphous thin films for mechanically flexible, multimaterial integrated photonics

3-D Flexible Glass Photonics

Stretchable and Flexible Photonics/electronics Devices and Transfer Printing

Chip-To-Chip Optical Interconnects Based on Flexible Integrated Photonics

Stretchable and Foldable Silicon Integrated Circuits

Complementary Metal Oxide Silicon Integrated Circuits Incorporating Monolithically Integrated Stretchable Wavy Interconnects

Stretchable silicon electronics and their integration with rubber, plastic, paper, vinyl, leather and fabric substrates

Mechanically-flexible wafer-scale integrated-photonics fabrication platform

Stretchable organic printed microlaser