Abstract:Today, continued miniaturization in electronic integrated circuits (ICs) appears to have reached its fundamental limit. At the same time, energy consumption due by communication becomes the dominant limitation in high performance electronic ICs for computing, and modern computing concepts such a neural networks further amplify the challenge. Photonic communication is a promising strategy to address the second, while adding a third dimension to the predominantly two dimensional integrated circuits appears the most promising future strategy for further IC architecture improvement. Crucial for efficient electronic-photonic co-integration is CMOS compatibility. Here, we review our latest results obtained in the FEMTO-ST RENATECH facilities on using additive photo-induced polymerization of a standard photo-resin for truly 3D photonic integration according to these principles. Based on one- and two-photon polymerization and combined with direct-laser writing, we 3D-printed air- and polymer-cladded photonic waveguides. An important application of such circuits are the interconnects of optical neural networks, where 3D integration enables scalability in terms of network size versus its geometric dimensions. In particular via \emph{flash}-TPP, a fabrication process combining blanket one- and high-resolution two-photon polymerization, we demonstrated polymer-cladded step-index waveguides with up to 6~mm length, low insertion ($\sim$0.26~dB) and propagation ($\sim$1.3~dB/mm) losses, realized broadband and low loss ($\sim$0.06~dB splitting losses) adiabatic 1 to M couplers as well as tightly confining air-cladded waveguides for denser integration. By stably printing such integrated photonic circuits on standard semiconductor samples, we show the concept's CMOS compatibility. With this, we lay out a promising, future avenue for scalable integration of hybrid photonic and electronic components.

3D Integrated Photonics Platform with Deterministic Geometry Control

3-D Flexible Glass Photonics

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3-D Integrated Flexible Glass Photonics

Integrated Flexible Chalcogenide Glass Photonic Devices

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Flexible integrated photonics: where materials, mechanics and optics meet [Invited]

(Invited) Mechanically Flexible Integrated Photonic Systems for Sensing and Communications

Monolithically Integrated Stretchable Photonics

Mechanically-flexible wafer-scale integrated-photonics fabrication platform

3D printing functional nano-photonic devices by multi-photon lithography

A fully-integrated flexible photonic platform for chip-to-chip optical interconnects

Amorphous thin films for mechanically flexible, multimaterial integrated photonics

Chip-To-Chip Optical Interconnects Based on Flexible Integrated Photonics

Multi-material heterogeneous integration on a 3-D Photonic-CMOS platform

In-Situ 3D Nano-Printing of Freeform Coupling Elements for Hybrid Photonic Integration

Combining one and two photon polymerization for accelerated high performance (3+1)D photonic integration

Additive 3D photonic integration that is CMOS compatible

A three-dimensional optical photonic crystal with designed point defects

Multi-Micron Silicon Photonics Platform for Highly Manufacturable and Versatile Photonic Integrated Circuits