Abstract:Today, continued miniaturization in electronic integrated circuits (ICs) appears to have reached its fundamental limit. At the same time, energy consumption due by communication becomes the dominant limitation in high performance electronic ICs for computing, and modern computing concepts such a neural networks further amplify the challenge. Photonic communication is a promising strategy to address the second, while adding a third dimension to the predominantly two dimensional integrated circuits appears the most promising future strategy for further IC architecture improvement. Crucial for efficient electronic-photonic co-integration is CMOS compatibility. Here, we review our latest results obtained in the FEMTO-ST RENATECH facilities on using additive photo-induced polymerization of a standard photo-resin for truly 3D photonic integration according to these principles. Based on one- and two-photon polymerization and combined with direct-laser writing, we 3D-printed air- and polymer-cladded photonic waveguides. An important application of such circuits are the interconnects of optical neural networks, where 3D integration enables scalability in terms of network size versus its geometric dimensions. In particular via \emph{flash}-TPP, a fabrication process combining blanket one- and high-resolution two-photon polymerization, we demonstrated polymer-cladded step-index waveguides with up to 6~mm length, low insertion ($\sim$0.26~dB) and propagation ($\sim$1.3~dB/mm) losses, realized broadband and low loss ($\sim$0.06~dB splitting losses) adiabatic 1 to M couplers as well as tightly confining air-cladded waveguides for denser integration. By stably printing such integrated photonic circuits on standard semiconductor samples, we show the concept's CMOS compatibility. With this, we lay out a promising, future avenue for scalable integration of hybrid photonic and electronic components.

In-Situ 3D Nano-Printing of Freeform Coupling Elements for Hybrid Photonic Integration

3D nanoprinting for fiber-integrated achromatic diffractive lens

Photonic Chiplet Interconnection via 3D-Nanoprinted Interposer

Hybrid multi-chip assembly of optical communication engines by in situ 3D nano-lithography

Nanoimprint of a 3D structure on an optical fiber for light wavefront manipulation

3D Integrated Photonics Platform with Deterministic Geometry Control

3D nano-printing coupler for silicon nitride suspended waveguide

Additive 3D photonic integration that is CMOS compatible

A universal approach for photonic integration on flexible substrates

Molded Transparent Photopolymers and Phase Shift Optics for Fabricating Three Dimensional Nanostructures.

Combining one and two photon polymerization for accelerated high performance (3+1)D photonic integration

Free-standing microscale photonic lantern spatial mode (De-)multiplexer fabricated using 3D nanoprinting

3D-Printed Optics for Wafer-Scale Probing

Free-form inverse design of arbitrary dispersive materials in nanophotonics

Multi-material heterogeneous integration on a 3-D Photonic-CMOS platform

Photonic wire bonding: An enabling technology for heterogeneous multi-chip integration

Hybrid integration of silicon photonics circuits and InP lasers by photonic wire bonding

Free-form micro-optics enabling ultra-broadband low-loss fiber-to-chip coupling

Femtosecond laser additive and subtractive micro-processing: enabling a high-channel-density silica interposer for multicore fibre to silicon-photonic packaging

Alignment-free integration of apertures and nontransparent hulls into 3D-printed micro-optics

Fabrication of optical components with nm- to mm-scale critical features using three-dimensional direct laser writing