Abstract:Abstract In this paper, we combine inverse design concept and direct binary search algorithm to demonstrate three ultra-compact high efficiency and low crosstalk on-chip integrated optical interconnection basic devices in the entire wavelength range of 1,400–1600 nm based on silicon-on-insulator platform. A 90-degree waveguide bend with a footprint of only 2.4 × 2.4 μm 2 is designed, whose transmission efficiency up to 0.18 dB. A waveguide crossing with a footprint of only 2.4 × 2.4 μm 2 is designed, which can provide insertion loss of less than 0.5 dB and crosstalk (CL) of lower than − 19 dB. A same direction waveguide crossing with footprint of only 2.4 × 3.6 μm 2 is designed, which can provide the insertion loss of less than 0.56 dB and the crosstalk of lower than − 21 dB. Then, we use them to form several ultra-compact optical interconnect basic structures and performed the simulation calculation. They overall achieve high performance. This will significantly improve the integration density.

What problem does this paper attempt to address?

The problem that this paper attempts to solve is to realize the design of ultra - compact, high - efficiency and low - crosstalk basic optical interconnection devices on silicon - based photonic integrated chips. Specifically, the authors combine the concept of inverse design and the direct binary search algorithm (DBS) to demonstrate three key basic optical interconnection devices based on the silicon - on - insulator (SOI) platform in the entire wavelength range of 1,400 - 1600 nm: 90 - degree waveguide bends, waveguide crossings and co - directional waveguide crossings. These devices have very small sizes (2.4 × 2.4 μm², 2.4 × 2.4 μm² and 2.4 × 3.6 μm² respectively) and exhibit excellent performance in terms of transmission efficiency and crosstalk. ### Main Objectives: 1. **Reduce Size**: Traditional waveguide bends and crossing devices usually have large sizes, which limit the integration density on the chip. In this paper, through inverse design and the DBS algorithm, the device size is successfully reduced to the micrometer level, significantly increasing the integration density. 2. **Improve Transmission Efficiency**: The designed 90 - degree waveguide bend has a transmission efficiency as high as 0.18 dB at certain wavelengths, and the insertion losses of the waveguide crossing and the co - directional waveguide crossing are respectively lower than 0.5 dB and 0.56 dB. 3. **Reduce Crosstalk**: The crosstalks of the waveguide crossing and the co - directional waveguide crossing are respectively lower than −19 dB and −21 dB, which is very important in multi - channel optical communication and can reduce the interference between signals. ### Design Methods: - **Inverse Design**: Design and optimize devices by setting target performance and using optimization algorithms such as the DBS algorithm. - **Pixel Partition**: The optimization area is divided into multiple pixels, and each pixel can be in a silicon or air state. - **Figure of Merit (FOM)**: Define a figure of merit to evaluate the performance improvement after each pixel state change. - **Iterative Optimization**: Through multiple iterations until the figure of merit no longer improves. ### Application Prospects: These ultra - compact, high - performance optical interconnection devices can not only significantly improve the integration density on the chip, but also be applied to various on - chip optical systems, such as optical power splitters, mode multiplexers and wavelength multiplexers, etc. In addition, this design idea and algorithm process can also be extended to the design of other on - chip photonic devices.

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