Investigation of Evanescent Coupling Between SOI Waveguides and Heterogeneously-Integrated III–V Pin Photodetectors

Zhen Sheng,Liu,Joost Brouckaert,Sailing He,Dries Van Thourhout,Roel Baets
DOI: https://doi.org/10.1109/iciprm.2009.5012467
2009-01-01
Abstract:Integrating III-V materials on Si is a promising candidate to realize both passive and active optical functions on a single silicon chip. We have developed this heterogeneous integration technology by means of an adhesive die-to-wafer bonding process under a low temperature. In this paper, efficient evanescent coupling between SOI waveguides and heterogeneously-integrated III-V pin photodetectors is proposed. The serious absorption by p-InGaAs and metal contact layers are greatly reduced by introducing a central opening on these layers. The thickness of the i-InGaAs layer is also optimized towards efficient absorption.
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