Wafer and chip-level characterization of edge-coupled photonic integrated circuits by cascaded grating couplers and spot-size converters

Moataz Eissa,Ryuya Sasaki,Tsuyoshi Horikawa,Tomohiro Amemiya,Nobuhiko Nishiyama
DOI: https://doi.org/10.35848/1347-4065/ad5fd5
IF: 1.5
2024-07-25
Japanese Journal of Applied Physics
Abstract:This study presents an efficient testing process for characterizing silicon photonic ICs. This process utilizes a coupling structure that integrates grating couplers and spot-size converters for efficient testing both at the chip and wafer levels, respectively. By leveraging wafer-level testing to estimate the characteristics of final chip-level devices, we anticipate a reduction in testing costs. To demonstrate the validity of the proposed testing process, we fabricated and measured silicon-on-insulator ring resonator devices on both wafer and chip levels. The results showed good agreement between the two levels of measurement, validating the effectiveness of our proposed testing process.
physics, applied
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