Enhanced Softening Resistance and Mechanical Properties of Mo2C Particle-Reinforced Cu-matrix Composites

Xiukuang Zhang,Qian Lei,Bin Liu,Xi Chen,You Li,Zhen Han,Huan Liu
DOI: https://doi.org/10.1016/j.compstruct.2022.116503
IF: 6.3
2023-01-01
Composite Structures
Abstract:Mo2C particles dispersion-strengthened copper matrix composites were fabricated by powder metallurgy and followed by a rolling process. Microstructure, mechanical properties, electrical conductivity, and softening resistance of Cu-xMo2C composites (x = 2, 5, 7 wt%) were studied systematically. Cu-5Mo2C composite exhibited the best combination of performances among the three composites. The tensile strength, hardness, and electrical conductivity of the as-rolled Cu-5Mo2C composite reached 405.3 MPa, 130.7 HV, and 88.4 % IACS, respectively. Grain boundary strengthening and dislocation strengthening were the primary strengthening mechanisms. Mo2C particles presented a stable microstructure and inhibited the grain coarsening of the matrix. The softening temperatures of annealed Cu-2Mo2C, Cu-5Mo2C, and Cu-7Mo2C composites were 680 degrees C, 770 degrees C, and 805 degrees C, respectively. These findings indicate that Mo2C particles can improve copper alloys' high-temperature softening resistance and mechanical properties.
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