Synthesis And Properties Of Hvpe Nitride Substrates

Rp Vaudo,Gr Brandes,Js Flynn,X Xu,Mf Chriss,Cs Christos,Dm Keogh,Fd Tamweber
2000-01-01
Abstract:Freestanding GaN was produced by growing 200 to 500 mum thick GaN by hydride vapor phase epitaxy on sacrificial sapphire wafers, which were subsequently removed. The resulting material was then sized and polished to produce GaN wafers as large as 40 mm in diameter. The concentration of dislocations in these wafers was as low as 3 x 10(6) cm(-2) at the upper surface. Capacitance-voltage measurements indicate that the background carrier concentration was as low as 3 x 10(15) cm(-2), consistent with the Si-concentration observed by secondary-ion mass spectroscopy. Homoepitaxial GaN films grown on the GaN substrates exhibit well defined and parallel step structure with a low density of step terminations. Double-heterojunction GaN/InGaN light-emitting diodes fabricated on the freestanding GaN exhibited greater than a four-fold increase in light power output as compared to identical structures grown on sapphire with an optimized nucleation layer.
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