Hvpe Homoepitaxial Growth of High Quality Bulk Gan Using Acid Wet Etching Method and Its Mechanism Analysis

Nanliu Liu,Yutian Cheng,Jiejun Wu,Xingbin Li,Tongjun Yu,Huan Xiong,Wenhui Li,Jiao Chen,Guoyi Zhang
DOI: https://doi.org/10.1016/j.jcrysgro.2016.08.038
IF: 1.8
2016-01-01
Journal of Crystal Growth
Abstract:In this paper, crack-free 2-inch bulk GaN wafer with the thickness up to 3mm was obtained by HVPE homoepitaxy. A new method of acid wet etching was used to pre-treat GaN substrate before re-growth. The formation of the mesh-like subsurface crack and interface layer were found to be suppressed between the re-growth layer and as-grown GaN substrate. EDS and time varied contact angle measurement proved that chemical etching would decrease the oxygen related surface adsorption and increase atoms diffusion length during HVPE homoepitaxial growth. Moreover, Morphology, Low temperature photoluminescence measurements indicated a reduction in stress of wet etching treated as-grown GaN substrate due to etching effect on its N face. High quality bulk GaN with the dislocation density of 1×106cm−2 was achieved by using wet etching and HVPE multiple re-growth. It would offer a simple method to obtain bulk GaN with thicker layer and high quality.
What problem does this paper attempt to address?