A Low-Cost and High-Efficiency Method for Four-Inch Silicon Nano-Mold by Proximity UV Exposure

Lei Sun,Helin Zou,Shengbo Sang
DOI: https://doi.org/10.1088/1361-6528/ac25ab
IF: 3.5
2021-01-01
Nanotechnology
Abstract:Nano-mold is an essential tool for nano-imprinting. However, large-area nano-mold fabrication relies on expensive equipment or complicated processing. Silicon nano-molds were achieved by proximity ultraviolet lithography and reactive ion etching (RIE). By optimizing the parameters in the processes of exposure, development, and RIE, silicon nano-mold with nano-scale ridges were fabricated with high-precision. The achieved minimum width of nano-ridges was 263 nm. This method is capable of fabricating silicon nano-mold covering four-inch wafer, which is simple, efficient and free from costly equipment.
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