FLASH MEMORY AND FABRICATING AND OPERATING METHOD THEREOF

Huang Ru,Cai Yimao,Qin Shiqiang,Huang Qianqian,Tang Poren,Tang Yu,Yang Gengyu
2012-01-01
Abstract:A flash memory and fabricating and operating method thereof are disclosed by the present invention. The flash memory includes two vertical-channel memory units with lightly doped N-type (or P-type) silicon as a substrate. A P+ region (or N+ region) is respectively located at either end of the silicon plane. Two channel regions perpendicular to the silicon plane are located in the middle. An N+ region (or P+ region) shared by the two channels is located above the channels. There are tunneling oxide layer, polysilicon floating gate, oxide barrier layer and polysilicon control gate ranked orderly from inner to outer of the outside of each channel, wherein the polysilicon floating gate and control gate are separated from the P+ region (or N+ region) by the side wall oxide layer. The entire device is a two-bit vertical-channel TFET type flash memory, which has good compatibility with the existing standard CMOS process and presents high programming efficiency, low power consumption, effective suppression of punch-through effect, high density and other advantages compared to the traditional flash memory based on the MOS field-effect transistor.
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