Flip-chip Interconnection Between Nb5N6 Terahertz Array Detectors and Readout Circuits

Zhenjie Li,Xinle Guo,Jin Feng Zhang,Danfeng Pan,Xuecou Tu,Xiaoqing Jia,Lin Kang,Jian Chen,Peiheng Wu
DOI: https://doi.org/10.1109/irmmw-thz46771.2020.9370602
2020-01-01
Abstract:Nb 5 N 6 microbolometer is a high sensitive terahertz detector at room temperature, but its integrated air cavity structure increases the difficulty of interconnection with readout circuit. For this reason, we optimized the flip chip process and successfully realized the interconnection between 32 × 32 array devices and readout circuits.
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