The Impact of Flip-chip Process on Nb5N6 Microbolometer Arrays for Terahertz Detection

Xinle Guo,Chengtao Jiang,Peng Xiao,Shimin Zhai,Xuecou Tu,Xiaoqing Jia,Lin Kang,Jian Chen,Peiheng Wu
DOI: https://doi.org/10.1109/irmmw-thz.2018.8509868
2018-01-01
Abstract:Flip-chip technology is a common way of connecting Terahertz (THz) array detectors with readout integrated circuits (ROICs). However, for our Nb 5 N 6 microbolometer THz array detectors, temperature and stress introduced from flip-chip process may adversely affect the performance of detectors. To evaluate this influence, firstly, we simulate the impact of solder bumps in a detector unit. Secondly, through flip-chip experiments between detectors and rewiring chips, we have characterized the performance of detectors before and after the process, which provide the technical support for optimizing this process and the interconnection between array detectors and ROICs.
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