Research of Electroless Ni-P Alloy Plating on Polyimide Substrate

Jianhui LIN,Yuanming CHEN,Shouxu WANG,Wei HE,Huaiwu ZHANG,Yongqiang PENG,Kehua AI,Qinghua LI
DOI: https://doi.org/10.3969/j.issn.1001-3849.2018.01.001
2018-01-01
Abstract:The electroless Ni-P coating was successfully prepared by utilizing the self-decomposition of formaldehyde on copper surface.The micro morphology,reflectivity,surface resistance and corrosion resistance of the prepared Ni-P coating were characterized by scanning electron microscope spectrometer,fourpoint probe method,potentiodynamic polarization and electrochemical impedance method,and also the adhesion strength was tested according to the National Standard GBT 5270-2005.Results showed that the prepared Ni-P coating on polyimide substrate was smooth and flat,the reflectivity was as high as 95%,the surface resistivity was about 10 Ω· cm,the adhesion strength met the National Standard and the corrosion resistance was far superior to silver plating.
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